TSMC Launches Automotive Process Qualification Specification and Service Package in China Market
TSMC Commits to China Automotive Excellence by Meeting AEC Guidelines
Hsinchu, Taiwan, R.O.C. â November 27, 2009 - Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it plans to launch the automotive industryâs first process qualification specification and service package for automotive-grade semiconductor manufacturing at the China IC Design Conference being held in Xiamen on December 2.
The company also announced that its Fab 10, located in Shanghai, is prepared to manufacture automotive grade ICs.
The automotive process qualification specification, made broadly public today, was first proposed at the Automotive Electronic Councilâs (AEC) annual Reliability Workshop in June 2008. Semiconductor devices in automobiles wear out quickly due to the stringent operating environment, and it is critical that the inherent manufacturing process can support semiconductor devices that will last far beyond the vehicleâs lifetime.
TSMC has also developed a comprehensive Automotive Service Package to complement customersâ test coverage and test methodology to reduce the field failure rate. TSMC Automotive Service Package incorporate tightened process control, device level screen limit, and wafer sorting scrap criteria, additional SPC monitoring, preferred tools, etc. It significantly reduces process variation and outliers.
âIntegrated circuits of all types are playing a larger role in the automotive industry. Our commitment is to support automotive IC technology including innovations that are taking place in China,â said Jason Chen, Vice President, Worldwide Sales and Marketing, TSMC. â We are backing this commitment with action by dedicating our efforts at Fab 10 in Shanghai to accelerate the growth of Chinaâs automotive present and future.â
TSMC Fab10 in Shanghai, along with multiple fabs in Taiwan, has successfully established the capability of supporting the automotive service package. The automotive process route in Fab10 is available for global auto supply chain companies, including those in China.
About TSMC
TSMC is the worldâs largest dedicated semiconductor foundry, providing the industryâs leading process technology and the foundryâs largest portfolio of process-proven libraries, IP, design tools and reference flows. The Companyâs total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers, including capacity from two advanced 12-inch - GigaFabsâ¢, four eight-inch fabs, one six-inch fab, as well as TSMCâs wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.
Related Semiconductor IP
- NPU IP Core for Mobile
- NPU IP Core for Edge
- Specialized Video Processing NPU IP
- HYPERBUS™ Memory Controller
- AV1 Video Encoder IP
Related News
- eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips
- Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C
- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
- Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process
Latest News
- Jim Keller: ‘Whatever Nvidia Does, We’ll Do The Opposite’
- FlexGen Streamlines NoC Design as AI Demands Grow
- IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability
- Global Semiconductor Sales Increase 2.5% Month-to-Month in April
- Speedata Raises $44M to Launch First-Ever Chip Designed Specifically for Accelerating Big Data Analytics - Compute's Second Largest Workload