Rambus Completes Acquisition of PLDA
Extends CXL™ and PCI Express® Digital IP Leadership
SAN JOSE, Calif. – August 18, 2021 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the completion of the acquisition of PLDA. With this acquisition, Rambus expands its digital controller offerings with complementary CXL 2.0, PCIe 5.0 and PCIe 6.0 controller and switch IP, and gains critical building blocks for its CXL Memory Interconnect Initiative.
“CXL and PCIe are critical enablers for next-generation data centers that will deliver the high-speed interconnects needed to tackle demanding workloads in AI/ML and HPC applications,” said Luc Seraphin, president and CEO of Rambus. “The addition of PLDA’s world-class digital IP and engineering expertise accelerates our roadmap and expands our market opportunity, and we are excited to welcome them to the team.”
Although this transaction will not materially impact 2021 financial results due to the timing of close and acquisition accounting, Rambus expects this acquisition to be accretive in 2022.
For more information, visit rambus.com/plda.
Related Semiconductor IP
- HBM4 PHY IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- VIP for Compute Express Link (CXL)
Related News
- Rambus to Acquire PLDA, Extending Leadership with Cutting -Edge CXL and PCI Express Digital IP
- Rambus Completes Acquisition of AnalogX
- Rambus Completes Acquisition of Hardent
- Combination of Parthus and Ceva Completed Today; ParthusCeva Launches Operations
Latest News
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract
- TSMC to Lead Rivals at 2-nm Node, Analysts Say
- Energy-efficient RF power modules developed using SOI technology