Sidense Broadens OTP Offering with Additional Process Nodes at SMIC

Customers Now Have Wider Access to Industry’s Smallest Footprint, Lowest Power and Highest Performance OTP IP

Ottawa, Canada and Shanghai, China - Dec. 21, 2007 - Sidense, a leading developer of Logic Non-Volatile Memory (NVM) IP cores, today announced that its one-time programmable (OTP) technology is available on Semiconductor Manufacturing International Corporation’s (SMIC) 180nm and 90nm processes.

Demand for OTP memory is growing rapidly in many applications and usages such as consumer electronics products, wireless products, code storage, product configuration, and trimming of analog circuits. “We are experiencing very strong demand for our OTP IP for chips processed from 180nm to 65nm,” said Steven Cliadakis, VP of Worldwide Sales at Sidense. “By working with SMIC, we are able to provide our customers with additional access to our IP at one more leading foundry.”

Many of today’s designs require very low power and cost-effective solutions. “Sidense’s OTP IP will allow our customers to meet their very aggressive power targets,” said Henry Liu, Senior Director, Design Services Division at SMIC. “Additionally, Sidense’s OTP is very small, which allows our customers in competitive markets, such as the consumer space, to achieve their low-cost goals.”

About Sidense

Sidense provides secure, dense and reliable non-volatile one-time programmable (OTP) memory IP for use in standard-logic CMOS processes, with no additional masks or process steps required. Sidense's patented one-transistor 1T-Fuse™ architecture provides the industry’s smallest footprint and lowest power Logic Non-Volatile Memory (NVM) solution.

Sidense OTP memory is available at 180nm, 130nm, 90nm and 65nm and scalable to 45nm and below. Ideal applications include analog trimming, code storage, encryption keys such as HDCP, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, visit www.sidense.com.