IntoPIX Showcases Next‑Gen IPMX & JPEG XS Innovations At ISE 2026

Barcelona, ISE 2026 – February 2, 2026 – intoPIX, the technology leader in low compression and AV‑over‑IP workflows, is introducing a powerful lineup of new IPMX‑ready solutions for OEMs, developers and integrators. The announcement includes advanced JPEG XS capabilities, newly IPMX-certified Titanium Apps, and updated Titanium SDK and FPGA SoC EDK development platforms.

At ISE 2026, intoPIX technologies will be showcased across three booths — intoPIX, AIMS/IPMX, and AMD — highlighting innovations spanning software, hardware, FPGA, and SoC platforms.

NEW TICOXS FIP INNOVATIONS: 8K, ULTRA‑DENSE DESIGNS & IPMX JPEG XS EXTENDED

intoPIX is introducing a major update to its TicoXS FIP codec family, delivering enhanced performance and IPMX interoperability:

  • New proxy encoder for lightweight previews and monitoring.
  • Full TDC and JPEG XS Extended support aligned with the IPMX specification.
  • New 8K JPEG XS codec for next-generation ultra-high-resolution IP workflows.
  • Ultra-dense FPGA implementations, enabling more channels per device.

These enhancements improve efficiency, enhance AV innovation, and multi-vendor interoperability for IPMX deployments.

TITANIUM APPS — NOW IPMX CERTIFIED AND SHIPPING WORLDWIDE

The Titanium App Suite achieved official IPMX certification in January 2026 and is now shipping globally as Version 1.1, with an active roadmap planned throughout the year.

Key highlights:

  • TitaniumShowandTitaniumViewerintroduce new features, including Privacy Encryption Protocol.
  • TitaniumViewer now runs on AMDPoE‑powered micro‑computers or Intel® SDM modules, enabling embedded IPMX receiver displays.
  • The solution now brings plug‑and‑play IPMX + NMOS workflows to ProAV integrators.
  • Additional feature expansions are planned across 2026.

  


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TITANIUM SDK & SoC EDK — UNIFIED IPMX, NMOS & ST 2110 DEVELOPMENT

intoPIX is launching new versions of its Titanium x86-64 SDK and SoC EDK for FPGA SoC and NVIDIA Jetson SoC platforms.

Key demonstrations at ISE include:

  • Unified IPMX, NMOS, and ST 2110 interoperability.
  • A camera demo featuring full IPMX capabilities over Gigabit on FPGA SoC.
  • A low-latency IPMX Edge AI demo running Titanium EDK on NVIDIA Jetson SoC, in collaboration with PhoenixAI and Yuan.

These platforms accelerate time-to-market for manufacturers building cameras, gateways, encoders, decoders, and professional AV equipment.

MEET INTOPIX AT ISE 2026

intoPIX technologies will be featured at:

  • The intoPIX booth (Hall 5 / 5F700) — full product demos.
  • The AIMS/IPMX booth — interoperability & certification workflows.
  • The AMD booth — accelerated FPGA/SoC implementations.

Visitors are also invited to celebrate 20 years of compression innovation with the intoPIX team during ISE 2026.

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