TSMC CLN5FF GUCIe LP Die-to-Die PHY
Global UniChip Corp. (GUC)
•
HQ:
Taiwan
IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face package.
- TSMC
- 5nm
- N5FF
Compare 8 Die-to-Die (D2D) PHY IP Listing from 7 vendors
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Cadence Design Systems, Inc.• HQ: USA
High-performance, low-latency PHY for D2D connectivity The UltraLink™ Die-to-Die (D2D) PHY enables SoC providers to deliver more …
- GlobalFoundries
- 12nm
- LP
- Silicon Proven
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Eliyan• HQ: USA
The NuLink technology delivers low-power and high-performance D2D IP core products, which support multiple industry standards and…
- Custom
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Blue Cheetah Analog Design, Inc.• HQ: USA
BlueLynx PHY IP is one side of a die-to-die parallel interface delivered as a single GDS Hard IP and a single RTL Soft IP.
- Custom
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MSquare• HQ: China
The Die-to-Die interface is a functional block that provides a data interface between two chip dies within the same package.
- UCIe
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MSquare• HQ: China
The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package.
- UCIe
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Innosilicon Technology Ltd• HQ: China
The UCIe Chiplet IP offers a cutting-edge solution for seamless, low-latency data transfer between dies and chips, enabling heter…
- UCIe
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D2D Controller addon for D2D SR112G PHY with CXS interface
Synopsys, Inc.• HQ: USAThe Die-to-Die Controller IP, optimized for latency, bandwidth, power, and area, enables efficient inter-die connectivity in serv…
- Custom