Vendor: SMIC Category: Flash

SMIC 130nm E-FLASH Standard digital IO for smart card or bank card application

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SMIC 130nm G In Production View all specifications

Key features

  • Standard digital IO for smart card or bank card application;
  • Cell Size (Width * height) 182um*335um with DUP inline bonding pads;
  • Work voltage:1.8V/3V/5V power;
  • SMIC 0.13um e-EEPROM (AEE2) Salicide 1.5V LL//5.0V/15.5V Process;
  • Suitable for 5, 6,7 and 8 layers application ;

Silicon Options

Foundry Node Process Maturity
SMIC 130nm G In Production

Specifications

Identity

Part Number
SP013LLEED5P_CARD
Vendor
SMIC

Provider

SMIC
HQ: China
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services at 0.35-micron to 28-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab in Beijing and a majority owned 300mm fab for advance nodes under development; a 200mm fab in Tianjin; and a 200mm fab project under development in Shenzhen. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong.
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Learn more about Flash IP core

Concealable physical unclonable functions using vertical NAND flash memory

Here, the authors propose a concealable PUF using V-NAND flash memory by generating PUF data through weak Gate-Induced-Drain-Leakage (GIDL) erase. The differences in doping depth among V-NAND strings arising from the fabrication cause variations in GIDL erase performance. The resulting V-NAND PUF demonstrated ideal security characteristics while maintaining 100% accuracy under variations in read count and temperature.

Maximizing Performance & Reliability for Flash Applications with Synopsys xSPI Solution

Systems using SoCs designed in advanced processes generally rely on external Flash devices that use NOR/NAND Flash memory technology for non-volatile storage. NOR Flash memory offers many benefits for device manufacturers and consumers, such as faster reading, low power consumption, and smaller area. In contrast, NAND Flash memories are ideal for applications such as data storage, where higher memory capacity and faster write and erase operations are required.

LPDDR flash: A memory optimized for automotive systems

Next-generation automotive systems are advancing beyond the limits of currently available technologies. The addition of advanced driver assistance systems (ADAS) and other advanced features requires greater processing power and increased connectivity throughout the vehicle.

Frequently asked questions about Embedded Flash IP cores

What is SMIC 130nm E-FLASH Standard digital IO for smart card or bank card application?

SMIC 130nm E-FLASH Standard digital IO for smart card or bank card application is a Flash IP core from SMIC listed on Semi IP Hub. It is listed with support for smic In Production.

How should engineers evaluate this Flash?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Flash IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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