Vendor: 1-VIA Category: PVT Monitor

PVT Sensor

1-VIA’s mixed signal capabilities empowering the industry’s most sensor IP portfolio with small footprint and integrated sensor f…

TSMC 12nm FFC View all specifications

Overview

1-VIA’s advanced mixed signal capabilities empowering the industry’s most complete sensor IP portfolio with small footprint and integrated sensor for PVT. Supported by leading technologies, our sensor IP provides enhanced power supply monitoring for both on-chip and system power, optimizing any power delivery subsystem.

Key features

  • Localized PVT measurement
  • Voltage spike detection for enhanced security
  • On-die integration
  • Energy efficiency empowered by dynamic load balancing
  • Industry’s most efficient power consumption
  • Industry’s smallest PVT core area

Files

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 12nm FFC

Specifications

Identity

Part Number
PVT Sensor
Vendor
1-VIA

Provider

1-VIA
HQ: UK
1-VIA are continuously developing state-of-the-art, high-speed and low-power transceivers targeting next-generation satellite, data centre, telecommunications and automotive markets. With some of the industry’s most skilled and experienced analog/mixed-signal IC designers onboard they have a combined experience of more than 100 years in cutting-edge silicon design of high-speed ADC, DAC and PLL.

Learn more about PVT Monitor IP core

Frequently asked questions about PVT Monitor IP cores

What is PVT Sensor?

PVT Sensor is a PVT Monitor IP core from 1-VIA listed on Semi IP Hub. It is listed with support for tsmc.

How should engineers evaluate this PVT Monitor?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this PVT Monitor IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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