Vendor: Ceva, Inc. Category: Bluetooth

Multi-protocol wireless platform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)

The Ceva-Waves Links200 is a fully integrated multi-protocol wireless platform in TSMC 12nm FFC+ supporting Bluetooth High Data T…

Overview

The Ceva-Waves Links200 is a fully integrated multi-protocol wireless platform in TSMC 12nm FFC+ supporting Bluetooth High Data Throughput and IEEE 802.15.4 for Zigbee, Thread and Matter compliance. It pre-integrates all the necessary hardware, software and radio components for a cost effective, low power and high-performance solution to enable the development of advanced smart edge AI SoC in an easy and fast time to market manner. Compliant with Bluetooth 6.0, Links200 supports a comprehensive feature set including Audio streaming (Classic Audio, LE Audio, Auracast Broadcast Audio) with High Data Throughput mode for next generation lossless multi-channel LE Audio streaming, Localization including AoA/AoD for Direction Finding and Channel Sounding for accurate and secure ranging, Low latency mode for gaming supporting up to 8KHz refresh rate.

The first member of the Ceva-Waves Links family, the Links100, is an integrated Wi-Fi 6 + Bluetooth 5.4 + 802.15.4 multi-protocol subsystem IP targeted for low power IoT applications.

Key features

  • Full Bluetooth dual mode (Classic and LE) support, including next generation High Data Throughput up to 7.5Mbps for lossless multichannel low latency audio streaming.
  • IEEE 802.15.4 support, for Zigbee, Thread and Matter
  • Comprehensive Integration: Includes RF, modem, controller, software stacks, and profiles.
  • Advanced Audio Support: Supports Classic Audio, LE Audio, and Auracast Broadcast Audio.
  • Accurate and Secure Ranging: Supports Bluetooth Channel Sounding for precise and secure ranging.
  • Optimized Process: Utilizes TSMC 12nm FFC+ process, ideal for advanced smart audio and Smart Edge AI SoCs.
  • Superior Performance: Fully featured with best-in-class power consumption, die size, and performance, with state-of-the-art RF architecture requiring minimal external components for low bill of materials.
  • Ease of Integration: Designed for fast time to market.
  • Customizable for further product differentiation, via tight integration with Ceva’s sensing and inference IPs, including Ceva-NeuPro-Nano NPU, and Ceva-RealSpace Spatial Audio.

Block Diagram

Files

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Specifications

Identity

Part Number
Ceva-Waves Links200
Vendor
Ceva, Inc.

Provider

Ceva, Inc.
HQ: USA
The Smart Edge runs on Ceva! Ceva is the leader in innovative silicon and software IP solutions that enable smart edge products to connect, sense, and infer data more reliably and efficiently. At Ceva, we are passionate about the smart edge. Providing the technology and market expertise our customers need to be successful is what we do best, and we’ve been doing it for over 30 years. With the industry’s only portfolio of comprehensive communications and scalable edge AI IP, Ceva powers the connectivity, sensing, and inference in today’s most advanced smart edge products across consumer IoT, mobile, automotive, infrastructure, industrial, and personal computing. More than 17 billion of the world’s most innovative smart edge products from smartphones to drones to cellular base stations and more are powered by Ceva. We create innovative technologies that help our customers turn great ideas into extraordinary products. We license our portfolio of wireless communications and scalable edge AI IP to our customers, breaking down barriers to entry and enabling them to bring new cutting-edge products to market faster, more reliably, efficiently, and economically. Ceva is a trusted partner to over 400 of the leading semiconductor and OEM companies including Actions, Artosyn, ASR, Atmosic, Autotalks, Beken, Bestechnic, Brite, Broadcom, Celeno, Ceragon, Cirrus Logic, Dialog Semiconductor, DSP Group, Espressif, FujiFilm, GCT Semi, iCatch, InPlay, Intel, Itron, Leadcore, LG Electronics, Mediatek, Microchip, Nextchip, Nokia, Novatek, NXP, ON Semiconductor, Optek, Oticon, Panasonic, RDA, Renesas, Rockchip, Rohm, Samsung, Sanechips, Sharp, Siflower, SigmaStar, Socionext, Sony, Socionext, Sonova, STMicroelectronics, Toshiba, Unisoc, Vatics, Yamaha and ZTE all leverage Ceva’s industry-leading IP. These companies incorporate our IP into application-specific integrated circuits (“ASICs”) and application-specific standard products (“ASSPs”) that they manufacture, market and sell to consumer electronics companies. Headquartered in Rockville, Maryland, Ceva has over 400 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States, Serbia, and sales and support offices located in Europe, the U.S. and throughout Asia. Ceva is a sustainable and environmentally conscious company, adhering to our Code of Business Conduct and Ethics. As such, we emphasize and focus on environmental preservation, recycling, the welfare of our employees and privacy – which we promote on a corporate level. At Ceva, we are committed to social responsibility, values of preservation and consciousness towards these purposes.

Learn more about Bluetooth IP core

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Three Major Inflection Points for Sourcing Bluetooth Intellectual Property

Synopsys is now shipping support for Bluetooth® 5.4, the latest specification from the Bluetooth SIG (Special Interest Group). The enhancements in Bluetooth 5.4 will open additional markets and use cases. This is one of the many inflection points in the Bluetooth Low Energy market that will be discussed in this paper.

Frequently asked questions about Bluetooth IP cores

What is Multi-protocol wireless platform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)?

Multi-protocol wireless platform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter) is a Bluetooth IP core from Ceva, Inc. listed on Semi IP Hub.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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