The Ceva-Waves Links200 is a fully integrated multi-protocol wireless platform in TSMC 12nm FFC+ supporting Bluetooth High Data Throughput and IEEE 802.15.4 for Zigbee, Thread and Matter compliance. It pre-integrates all the necessary hardware, software and radio components for a cost effective, low power and high-performance solution to enable the development of advanced smart edge AI SoC in an easy and fast time to market manner. Compliant with Bluetooth 6.0, Links200 supports a comprehensive feature set including Audio streaming (Classic Audio, LE Audio, Auracast Broadcast Audio) with High Data Throughput mode for next generation lossless multi-channel LE Audio streaming, Localization including AoA/AoD for Direction Finding and Channel Sounding for accurate and secure ranging, Low latency mode for gaming supporting up to 8KHz refresh rate.
The first member of the Ceva-Waves Links family, the Links100, is an integrated Wi-Fi 6 + Bluetooth 5.4 + 802.15.4 multi-protocol subsystem IP targeted for low power IoT applications.
