Vendor: T2M GmbH Category: Bluetooth

Bluetooth Dual Mode v5.4 / IEEE 15.4 PHY/RF IP in TSMC22nm ULP

The Ultra-Low-Power DM RF transceiver IP in TSMC22 ULL is designed to meet 2.4 GHz standards like Bluetooth Classic (BR/EDR), Blu…

TSMC 22nm ULP In Production View all specifications

Overview

The Ultra-Low-Power DM RF transceiver IP in TSMC22 ULL is designed to meet 2.4 GHz standards like Bluetooth Classic (BR/EDR), Bluetooth Low Energy, 802.15.4 PHY Layer (e.g. ZigBee), and proprietary standards.
This DM IP targets by far the lowest power consumption (<3 mW) together with state-of-the-art performances (sensitivity, interferers rejection) and with minimal cost.
Thanks to its built-in LDOs, its fully programmable modem, and its interface compatible with leading BT baseband controllers, this DM IP is optimized for easy integration into ASICs and SoCs.

Key features

  • Bluetooth 5.4 Dual-Mode radio, including EDR and LE 2Mbps for high-quality BT-audio streaming.
  • Long Range and Direction Finding (DF) BLE options.
  • Integrated Link Layer & MODEM functionalities.
  • Flexible modem compatible with 802.15.4-2011 and other modulations
  • Modes of TRx Operation: BLE Only and (BLE+Classic) Dual Mode
  • TSMC22nm ULL
  • Industrial temperature range: -40°C to +125°
  • Average power consumption for stereo audio streaming: 1.1mW (Bluetooth EDR) / 0.6 mW (BLE)
  • Best-in-class sensitivity: BLE -98 dBm; EDR -95 dBm
  • High Tx power: Upto +13 dBm

Block Diagram

Benefits

  • This RF has the Lowest Power Consumption in the market.

Applications

  • TWS earbuds, Headsets
  • Smart Speakers, Wearables

What’s Included?

  • GDS2
  • Behavioral model for the analog/RF portion
  • RTL for the digital portion
  • Related test benches
  • Documentation

Files

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 22nm ULP In Production

Specifications

Identity

Part Number
BT Dual Mode v5.4 RF PHY IP in TSMC 22nm
Vendor
T2M GmbH

Provider

T2M GmbH
T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets. T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules. With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.

Learn more about Bluetooth IP core

HDT Bluetooth: the Next Step in High Quality Audio Streaming

Wireless audio (wireless earbuds, headphones and speakers) introduced us to a completely new level of listening convenience and freedom, prompting the rapid growth we are already seeing in this consumer segment (30% CAGR for wireless earbuds and 14% for wireless headphones). Now the race is on to further improve audio quality and capability in these devices.

Three Major Inflection Points for Sourcing Bluetooth Intellectual Property

Synopsys is now shipping support for Bluetooth® 5.4, the latest specification from the Bluetooth SIG (Special Interest Group). The enhancements in Bluetooth 5.4 will open additional markets and use cases. This is one of the many inflection points in the Bluetooth Low Energy market that will be discussed in this paper.

Frequently asked questions about Bluetooth IP cores

What is Bluetooth Dual Mode v5.4 / IEEE 15.4 PHY/RF IP in TSMC22nm ULP?

Bluetooth Dual Mode v5.4 / IEEE 15.4 PHY/RF IP in TSMC22nm ULP is a Bluetooth IP core from T2M GmbH listed on Semi IP Hub. It is listed with support for tsmc In Production.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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