TTPCom announces first customer for 3G chipset design

CBEmacro 3G design enables semiconductor vendors to compete effectively in the high growth WCDMA/EDGE/GPRS market

Cambridge, UK - 12 Jan 2006 - TTP Communications plc [LSE:TTC] today announces that its subsidiary, TTPCom Ltd ('TTPCom') has signed a contract for its cellular baseband chipset design, CBEmacro 3G. CBEmacro exploits TTPCom's intelligent architecture to deliver a proven and robust communications sub-system, enabling innovative and price competitive chipsets with a shorter time-to-market. Semiconductor vendors adopting CBEmacro can expect to sample silicon within nine months of project start. The customer details remain confidential at this stage.

TTPCom's CBEmacro 3G is a complete and ready for silicon multi-mode GSM/EDGE/W-CDMA cellular baseband modem design. CBEmacro includes processors, peripherals, communications hardware, protocol software and external interfaces, delivered and warranted as a 'black box' silicon IP core.

"Semiconductor manufacturers incorporating the CBEmacro 3G design into their products can reduce overall system cost and time to market by allowing their engineering efforts to focus on product applications and peripheral mix rather than the complexities of developing and maintaining the modem and protocol stack," says Julian Hildersley, Managing Director of TTPCom's Silicon Business Unit. "This will allow customers to develop world class chipset solutions that will be highly competitive in die size, power consumption and applications capability."

This announcement represents a major milestone in TTPCom's development of the next generation of 3G Intellectual Property platforms. TTPCom will release an HSDPA upgrade for CBEmacro 3G early in 2006, incorporating a high performance advanced digital receiver design capable of operation at the full Category 10 rates (14Mbits/sec).  Further additions to the CBEmacro family of semiconductor designs are also under development.

About TTP Communications plc

Based in Cambridge, UK, TTP Communications plc (LSE: TTC) is a holding company that controls three organisations involved in different areas of mobile communications technology:

TTPCom Limited (www.ttpcom.com), its primary operating subsidiary, develops intellectual property used in the design and manufacture of wireless communication terminals and its licensees include leading semiconductor and terminal manufacturers worldwide.

ip.access - designs and manufactures GSM and GPRS infrastructure solutions that integrate with IP-based networks to provide cost-effective mobile radio coverage within buildings (http://www.ipaccess.com).

7 layers UK - a test and certification business for handset manufacturers (www.7layers.com). TTP Communications has 50% share.