TSMC Discusses Next MEMS, Monolithic Mics
Peter Clarke, EETimes
9/22/2015 05:58 AM EDT
LONDON — To expand its role as a supplier to fabless MEMS vendors foundry TSMC plans to use its advantages in being able to combine CMOS logic and MEMS sensors together to come up with innovative sensors and use cases.
It plans to do this both through its capabilities in stacking and packaging multiple die and through monolithic integration, according to Kees Joosse, director of business development at TSMC Europe.
Joosse was speaking at the European MEMS Summit, organized by the SEMI trade association in Milan, September 17 and 18, and laid out the strengths in MEMS that TSMC wants to play to and the next platforms that TSMC will offer, MEMS microphones and gas sensors.
To read the full article, click here
Related Semiconductor IP
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
- Flipchip 1.8V/3.3V I/O Library with ESD-hardened GPIOs in TSMC 12nm FFC/FFC+
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
Related News
- TSMC Announces Dr. Mark Liu Not to Participate in Next Board of Directors Election
- After TSMC fab in Japan, advanced packaging facility is next
- Omnitron Sensors Secures $13M+ Series A Funding, Fueling Next Generation of MEMS Sensors
- Ohio team studies friction shortfalls of MEMS
Latest News
- SiMa.ai Raises $85M to Scale Physical AI, Bringing Total Funding to $355M
- Armv9 and CSS Royalties Drive Growth in $1bn Arm Q1 Earnings
- Creonic Releases DVB-S2X Demodulator Version 6.0 with Increased Bitwidth and Annex M Support
- Arm Q1 FYE26 Revenue Exceeds $1 Billion for Second Consecutive Quarter
- 1‑VIA Expands Globally with New India R&D Office in Pune to Accelerate Innovation in Data Center Connectivity