Sonics files for IPO
Peter Clarke, EE Times
(08/27/2007 10:42 AM EDT)
(08/27/2007 10:42 AM EDT)
LONDON -- Sonics Inc. (Mountain View, Calif.) has filed forms with the Securities & Exchange Commission for an initial public offering of common stock.
Sonics provides interconnect intellectual property and EDA tools to configure it for use joining blocks together on system chips. According to one report Sonics is looking to raise $80 million in the IPO.
To read the full article, click here
Related Semiconductor IP
- NoC System IP
- Non-Coherent Network-on-Chip (NOC)
- Coherent Network-on-Chip (NOC)
- High speed NoC (Network On-Chip) Interconnect IP
- Smart Network-on-Chip (NoC) IP
Related News
- Freescale files for $1.15 billion IPO
- Freescale files for IPO to raise $1 billion
- Sonics Files Lawsuit Against Arteris for Patent Infringement
- China's VeriSilicon Files For IPO
Latest News
- Cyient Semiconductors Enters Strategic Channel Partnership with GlobalFoundries
- Aion Silicon Successfully Completes ISO 9001 and ISO/IEC 27001 Surveillance Audit, Strengthening Commitment to Quality and Security
- Baya Systems Awarded Globally Recognized ISO 9001:2015 Certification for Quality Management by TÜV Rheinland
- Si2 Announces Creation of the Si2 LLM Benchmarking Coalition
- Qualitas Semiconductor Signs Licensing Agreement with Chinese SoC Company for DSI-2 Controller and MIPI PHY IP