Silicon on Insulator Penetrates Apple/Intel/IBM
Soitec CEO: Cusp of exponential growth
R. Colin Johnson, Technology Editor, EE Times
10/7/2015 08:45 PM EDT
In a exclusive interview, Soitec's CEO and board chairman reveals that the Apple iPhone 6s has multiple RF chips built on silicon-on-insulator (SOI) substrates and even long-time rejector of SOI--Intel--and IBM are using SOI for their silicon photonics push.
Silicon-on-insulator (SOI) has had a long rocky road to success, but it appears to be on track to major market penetration—so much so that senior vice president and general manager Rutger Wijburg of GlobalFoundries bet me a bottle of wine that fully-depleted silicon-on-insulator (FD-SOI) would be outselling FinFETs within four years.
And no wonder, since Wijburg announced details here at the SEMICON Europa 2015 (Oct.6-8) of GlobalFoundries' 22-nanometer “22FDX” SOI platform, which it claims delivers FinFET-like performance but at a much lower power point and at a cost comparable to 28-nanometer planar technologies. The 300-millimeter $250 million FD-SOI foundry here in the “Silicon Saxony” area of Germany, builds on 20 years of GlobalFoundries' investments in Europe’s largest semiconductor fabs.
To read the full article, click here
Related Semiconductor IP
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
Related News
- Silicon Creations Expands Clocking IP Portfolio on TSMC N2P Technology including Novel Temperature Sensor Design
- GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology
- Baya Systems, Imagination Technologies and Andes Technology to Present on Heterogeneous Compute Architectures at Andes RISC-V CON Silicon Valley
- Inside Cyient Semiconductors Bet on RISC-V for Custom Silicon
Latest News
- SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology
- StarFive Launches New Product, Achieving RISC-V’s Breakthrough in Large-Scale Data Center Commercialization
- d-Matrix and Alchip Announces Collaboration on World's First 3D DRAM Solution to Supercharge AI Inference
- d-Matrix and Andes Team on World's Highest Performing, Most Efficient Accelerator for AI Inference at Scale
- Ceva Receives 2025 IoT Edge Computing Excellence Award from IoT Evolution World