GSA Reports All Semiconductor Company Segments Garnered Funding in August 2011
September 21, 2011 -- GSA Releases August Statistics from its Global Semiconductor Funding, IPO and M&A Update, including:
- In August, six semiconductor companies raised $65.3 million, down 20.0% from the $81.6 million raised in July 2011. August’s funding total decreased year-over-year (YoY) at a rate of 17.3%.
- In August, all company segments garnered funding.
- For the third consecutive month, zero semiconductor companies priced. August saw only one semiconductor company file for an initial public offering -- M/A-COM Technology Solutions Holdings, Inc.
- When looking at the closing stock prices posted on August 31 for those companies that priced in 2011, with the exception of Ingenic Semiconductor, zero companies posted a higher stock price than their offer price.
- In August, the number of semiconductor mergers and acquisitions (M&As) announced (i.e., M&As of entire fabless, IDM and semiconductor supplier companies, not sectors/product lines or foundry facilities) decreased by eight MoM and three YoY.
When: Now available at http://www.gsaglobal.org/publications/fundings/index.asp
About GSA
The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. www.gsaglobal.org
Related Semiconductor IP
- ISO/IEC 7816 Verification IP
- 50MHz to 800MHz Integer-N RC Phase-Locked Loop on SMIC 55nm LL
- Simulation VIP for AMBA CHI-C2C
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
Related News
- TSMC August 2011 Sales Report
- Edge AI company AlphaICs raises $8 million in funding round led by Emerald Technology Ventures and Endiya Partners
- Xiphera receives Business Finland's Young Innovative Company funding
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
Latest News
- Quintauris and Andes Technology Partner to Scale RISC-V Ecosystem
- Europe Achieves a Key Milestone with the Europe’s First Out-of-Order RISC-V Processor chip, with the eProcessor Project
- Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A
- TSMC September 2025 Revenue Report
- Andes Technology Hosts First-Ever RISC-V CON in Munich, Powering Next-Gen AI and Automotive Solutions