Rambus Renews Patent License Agreement With Toshiba
New agreement expands collaboration between companies to include a broad range of memory and interface technologies
SUNNYVALE, Calif.-- December 29, 2015 --Rambus Inc. (NASDAQ:RMBS) today announced that it has renewed its patent license agreement with Toshiba Corporation. Under the terms of the new three-year agreement, Toshiba will be licensing a broad range of technologies from Rambus to cover products that include SoC’s with DRAM memory controllers and/or serial link interfaces, as well as Flash Memory and system products. Specific terms of this agreement are confidential.
“We are pleased to have expanded our relationship with Toshiba, one of the global leaders in the semiconductor industry,” said Luc Seraphin, senior vice president and general manager of the Memory and Interfaces Division at Rambus. “Toshiba has been a valuable customer of Rambus for more than a decade, and this renewal reinforces the value of our innovative technology and IP.”
Rambus develops enhanced, industry-compliant chipsets, custom memory and serial link technologies, and services to address power, performance, and capacity challenges for the mobile, connected device, and Big Data cloud computing markets. Rambus also drives innovations in silicon to cloud security and computational sensor technologies, making digital products safer and better.
For more details, please visit rambus.com.
About Rambus Memory and Interfaces Division (MID)
The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the mobile, connected device, and cloud computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.
About Rambus Inc.
Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.
Related Semiconductor IP
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
Related News
- Rambus and Micron Extend Patent License Agreement
- Rambus and AMD Extend Patent License Agreement
- Rambus and Kioxia Renew Patent License Agreement
- Rambus and Socionext Renew Patent License Agreement
Latest News
- SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology
- StarFive Launches New Product, Achieving RISC-V’s Breakthrough in Large-Scale Data Center Commercialization
- d-Matrix and Alchip Announces Collaboration on World's First 3D DRAM Solution to Supercharge AI Inference
- d-Matrix and Andes Team on World's Highest Performing, Most Efficient Accelerator for AI Inference at Scale
- Ceva Receives 2025 IoT Edge Computing Excellence Award from IoT Evolution World