Rambus Joins DARPA Toolbox Initiative with State-of-the-Art Security and Interface IP
SAN JOSE, Calif. – April 14, 2021 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced a commercial licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for the agency’s programs. The agreement makes all Rambus security, memory interface, and SerDes interface IP products available to DARPA researchers. As licensees, DARPA researchers benefit by having access to IP offering renowned security protection and the world’s fastest chip interfaces.
“Rambus has the industry’s broadest portfolio of state-of-the-art security IP products, and offers leading interface IP at some of the highest bandwidths available,” said Sean Fan, chief operating officer at Rambus. “We are excited to add our full suite of cutting-edge silicon IP to DARPA Toolbox, and look forward to the new opportunities to provide our solutions and expertise for their ecosystem.”
The DARPA Toolbox initiative is an agency-wide effort to provide open licensing opportunities with commercial technology vendors to the researchers behind DARPA programs. Through DARPA Toolbox, successful proposers will receive greater access to commercial vendors’ technologies and tools via pre-negotiated, low-cost, non-production access frameworks and simplified legal terms. For commercial vendors, DARPA Toolbox will provide an opportunity to leverage the agency’s forward-looking research and a chance to develop new revenue streams based on programmatic achievements developed with their technologies.
“With Rambus joining our DARPA Toolbox Initiative, we add state-of-the-art security and interface technologies,” Serge Leef, the Microsystems Technology Office (MTO) program manager at DARPA leading DARPA Toolbox. “Our researchers will now have streamlined access to this cutting-edge IP to accelerate the speed of development for their projects.”
Through the DARPA Toolbox, researchers will have access to all Rambus Security, Memory Interface and SerDes Interface IP solutions including:
Rambus Security IP
- Root of Trust Solutions
- Secure Protocol Engines for MACsec, IPsec and TLS/DTLS/SSL
- Cryptographic Accelerator Cores
Rambus Memory and SerDes Interface IP
- HBM2E Memory Interface (PHY and controller)
- GDDR6 Memory Interface (PHY and controller)
- PCI Express 5.0 Interface (PHY and controller)
Rambus is one of a limited number of select technology companies to sign commercial partnership agreements under DARPA Toolbox. Rambus technologies under the initiative serve a broad range of applications from Data Center, Edge, 5G networking, Artificial Intelligence (AI), to Internet of Things (IoT).
For more information on Rambus Security solutions, please visit rambus.com/security. To learn more about Rambus Interface IP, visit rambus.com/interface-ip/.
Related Semiconductor IP
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- All Digital Fractional-N RF Frequency Synthesizer PLL in GlobalFoundries 22FDX
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
Related News
- Flex Logix and DARPA Expand Partnership with the Addition of Silicon Proven EFLX eFPGA in 12 and 16 nm Process Technologies for DARPA's Toolbox Initiative
- QuickLogic Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Programmable Logic
- Lattice Partners with DARPA Toolbox Initiative to Accelerate Technology Innovation
- eMemory and PUFsecurity Join DARPA Toolbox Initiative
Latest News
- SEMIFIVE Files for Pre-IPO Review on KRX
- Innosilicon Scales LPDDR5X/5/4X/4 and DDR5/4 Combo IPs to 28nm and 22nm, Cementing Its Position as the ‘One Stop’ for Memory Interface Solutions
- Synopsys Completes Acquisition of Ansys
- Zephyr 4.0 Now Available for SCR RISC-V IP
- Lattice Semiconductor and Missing Link Electronics Become Partners to Accelerate FPGA Design Projects