Omni Design Opens Design Center in Hyderabad, India
To Target Development of IP for 5G, Automotive and Artificial Intelligence
SAN JOSE, Calif., – March 21, 2023 – Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal intellectual property (IP) products, today announced the opening of a new design center in Hyderabad, India. This will be the fifth design center adding to the existing design centers in Milpitas (California), Fort Collins (Colorado), Billerica (Massachusetts) and Bangalore (India).
Omni Design provides high-performance, ultra-low power analog-to-digital converter (ADC), digital-to-analog converter (DAC) and analog front end (AFE) IP products, as well as compact and low-power process, voltage and temperature (PVT) monitors in advanced FinFET nodes to 28nm process nodes. Omni Design is growing rapidly and actively recruiting top talent in analog and digital design and systems engineering. The Hyderabad design center will contribute to all of the company’s product families.
“With the growth in next generation wireless communication, automotive, machine-learning and space communication markets, customer demand for Omni Design IP is growing at a fast pace,” said Dr. Kush Gulati, President and CEO of Omni Design Technologies. “Hyderabad is a key location as it offers a rich pool of highly-skilled and experienced analog, digital and mixed signal engineers needed to design the high performance, low power IP products being developed by Omni Design.”
For more information about Omni Design’s IP portfolio please visit www.omnidesigntech.com.
About Omni Design Technologies
Omni Design Technologies is the leading provider of high-performance, ultra-low power Mixed Signal IP cores in advanced process technologies that enable highly differentiated systems-on-chip (SoCs) in applications ranging from wired and wireless communications, automotive, imaging, sensors, and IoT. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaborating with customers to enable their success. The company is headquartered in Milpitas (California) with additional offices in Fort Collins (Colorado), Billerica (Massachusetts), Bangalore (India), Hyderabad (India) and Ireland. For more information, visit www.omnidesigntech.com.
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor
- StarIC opens design center in The Netherlands
- TSMC to Open EU Design Center in Munich in Q3
- Andes Technology Advances High-Performance RISC-V Strategy with U.S.-based Design Center: Condor Computing
Latest News
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract