MPU startup Transmeta files IPO
MPU startup Transmeta files IPO
By Semiconductor Business News
August 17, 2000 (9:17 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000817S0032
SANTA CLARA, Calif. -- Transmeta Corp. here today announced that it will file an initial public offering in an effort to generate working capital for its fledging x86-compatible microprocessor business. Serving as the underwriters for the IPO include Morgan Stanley Dean Witter, Deutsche Banc Alex. Brown, Salomon Smith Barney, Banc of America Securities LLC, and SG Cowen. Transmeta, which did not disclose details or a timetable for the IPO, hopes to use the proceeds to develop new products, expand its operations, and compete more favorably against the likes of Advanced Micro Devices Inc. and Intel Corp., analysts said. Recently, Transmeta made a big splash by rolling out its initial x86-compatible processors for notebook PCs and Internet-enabled devices. Earlier this week, the company announced a new processor for mainstream notebooks, while giving an update on its growing customer base (see Aug. 16 story).
Related Semiconductor IP
- ISO/IEC 7816 Verification IP
- 50MHz to 800MHz Integer-N RC Phase-Locked Loop on SMIC 55nm LL
- Simulation VIP for AMBA CHI-C2C
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
Related News
- Transmeta Files 2006 Annual Report With SEC and Provides Progress Update on 2007 Restructuring Plan
- Sonics files for IPO
- Freescale files for $1.15 billion IPO
- Freescale files for IPO to raise $1 billion
Latest News
- Quintauris and Andes Technology Partner to Scale RISC-V Ecosystem
- Europe Achieves a Key Milestone with the Europe’s First Out-of-Order RISC-V Processor chip, with the eProcessor Project
- Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A
- TSMC September 2025 Revenue Report
- Andes Technology Hosts First-Ever RISC-V CON in Munich, Powering Next-Gen AI and Automotive Solutions