MPU startup Transmeta files IPO
MPU startup Transmeta files IPO
By Semiconductor Business News
August 17, 2000 (9:17 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000817S0032
SANTA CLARA, Calif. -- Transmeta Corp. here today announced that it will file an initial public offering in an effort to generate working capital for its fledging x86-compatible microprocessor business. Serving as the underwriters for the IPO include Morgan Stanley Dean Witter, Deutsche Banc Alex. Brown, Salomon Smith Barney, Banc of America Securities LLC, and SG Cowen. Transmeta, which did not disclose details or a timetable for the IPO, hopes to use the proceeds to develop new products, expand its operations, and compete more favorably against the likes of Advanced Micro Devices Inc. and Intel Corp., analysts said. Recently, Transmeta made a big splash by rolling out its initial x86-compatible processors for notebook PCs and Internet-enabled devices. Earlier this week, the company announced a new processor for mainstream notebooks, while giving an update on its growing customer base (see Aug. 16 story).
Related Semiconductor IP
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
Related News
- Transmeta Files 2006 Annual Report With SEC and Provides Progress Update on 2007 Restructuring Plan
- Sonics files for IPO
- Freescale files for $1.15 billion IPO
- Freescale files for IPO to raise $1 billion
Latest News
- SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
- SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
- TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
- Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI
- QuickLogic Announces $13 Million Contract Award for its Strategic Radiation Hardened Program