Mindspeed Announces Definitive Agreement to Sell Assets of Its Wireless Infrastructure Unit to Intel
NEWPORT BEACH, Calif. -- Dec. 16, 2013 -- Mindspeed Technologies, Inc. (Nasdaq:MSPD), a leading supplier of semiconductor solutions for network infrastructure, today announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corporation (Nasdaq:INTC). The asset sale was contemplated by the agreement and plan of merger with M/A-COM Technology Solutions Holdings, Inc. (Nasdaq:MTSI), announced on November 5, 2013.
"We are excited that our wireless infrastructure business is being incorporated into Intel," commented Raouf Y. Halim, chief executive officer of Mindspeed.
The parties expect the transaction to close in February 2014 subject to satisfaction or waiver of various closing conditions. Morgan Stanley & Co. LLC acted as financial advisor to the board of directors of Mindspeed. Further details of the transaction can be found in the Current Report on Form 8-K filed with the SEC by Mindspeed today.
About Mindspeed Technologies
Mindspeed Technologies (Nasdaq:MSPD) is a leading provider of network infrastructure semiconductor solutions to the communications industry. The company's low-power system-on-chip (SoC) products are helping to drive video, voice and data applications in worldwide fiber-optic networks and enable advanced processing for 3G and long-term evolution (LTE) mobile networks. The company's high-performance analog products are used in a variety of optical, enterprise, industrial and video transport systems. Mindspeed's products are sold to original equipment manufacturers (OEMs) around the globe. On November 5, 2013, Mindspeed announced that it has entered into a definitive agreement to be acquired by M/A-COM Technology Solutions Holdings, Inc., a leading supplier of high performance RF, microwave and millimeter wave products.
To learn more, please visit www.mindspeed.com.
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Altera and BigCat Wireless Partner to Accelerate Deployment of Altera’s Open Radio Unit Reference Designs in Wireless Communications Infrastructure
- GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications
- Real Wireless Research Shows One Third Reduction for Private Network Infrastructure Cost Using AccelerComm 5G physical layer IP solution
- CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets
Latest News
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract