Malaysia's 1st Silicon works with Singapore's FTD on IP core verification
Malaysia's 1st Silicon works with Singapore's FTD on IP core verification
By Semiconductor Business News
February 26, 2002 (6:37 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020226S0044
KUCHING, Malaysia -- Semiconductor foundry supplier 1st Silicon (Malaysia) Sdn. Bhd. here today announced a marketing and technical support agreement with Singapore-based FTD Technology Pte. Ltd., a provider of analog and mixed-signal intellectual property (IP) for chip designs. "Both companies will select the IP cores to be designed onto a 1st Silicon testchip," said P. Bala, chief executive officer of FTD Technology. "We will coordinate the development, performance characterization, design flow verifications and functional verifications of FTD's cores based on 1st Silicon's testchip layout and test plans, their Spice models, library, and 1st Silicon's design rules." He said the collaboration will enable both companies to increase offerings for mutual customers. Four-year-old 1st Silicon's 200-mm wafer fab will have a capacity in excess of 30,000 eight-inch wafers per month when fully ramped. The company started volume production with 0.25 -micron digital and mixed-signal CMOS technology one year ago, and it has introduced 0.18-micron processes.
Related Semiconductor IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
- PDM Receiver/PDM-to-PCM Converter
Related News
- Truechip Partners with Advinno to Market Verification IP Products in Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia, Brunei & Cambodia
- BrisbaneSilicon publishes Beta Release of its Lumorphix Processor IP Core
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Codasip looks to Silicon Creations’ PLL to drive RISC-V Automotive Safety-Critical Core
Latest News
- Seligman Ventures Leads Cognichip’s $60M Series A to Back Physics-Informed AI for Chip Design, Intel CEO Lip-Bu Tan and Seligman Ventures’ Umesh Padval Join the Board
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
- Intel to Repurchase 49% Equity Interest in Ireland Fab Joint Venture
- AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees
- EnSilica selected for UK CHERI Adoption Collective