Lattice Semiconductor Further Expands CrossLink Applications with Modular IP Cores
Salarié Structure Type Date début Date fin Solde au 30/11/2024 Solde Prévisionnel au 31/05/2024 Congés en cours d’acquisition Solde congés Congés à acquérir Solde prévisionnel en fin de contrat
Latest IP Cores Enable More Flexible Video Bridging Capabilities for Consumer, Industrial and Automotive Applications
PORTLAND, OR — Aug. 29, 2017 — Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, announces the availability of seven new modular IP cores for its award winning CrossLink FPGA product for increased design flexibility to support consumer, industrial and automotive applications. These modular IP cores offer the building blocks for customers to create their own unique video bridging solutions.
The mobile industry, through its demand for high volumes and exceptional performance, has created video components such as processors, displays, and sensors that are valued in other “mobile-influenced” markets. These markets demand cost-effective devices that bridge between MIPI® and other traditional or legacy display and camera interfaces.
“Our customers are asking for FPGAs with MIPI D-PHY capability to solve increasingly difficult video interface problems. Too often, they reach barriers with solutions that miss the mark on power efficiency, size and performance,” said Tom Watzka, product marketing manager at Lattice Semiconductor. “For more than a year, Lattice’s CrossLink devices and its portfolio of IP cores have delivered the tools needed to overcome these challenges. These new IP cores add to an already robust suite of tools to support quickly evolving intelligence at the edge applications.”
Announced in May 2016, the CrossLink product was designed to address barriers faced by the increasingly complex and dynamic video market. Lattice equipped designers with a new way to deliver low power and compact bridging solutions without compromising performance to deliver cutting-edge innovations for multiple growth markets including automotive, AR/VR and drones.
The new CrossLink modular IP cores include:
- CSI-2/DSI D-PHY Receiver — Converts MIPI CSI-2/DSI data streams to parallel data
- CSI-2/DSI D-PHY Transmitter — Converts parallel formatted data streams to MIPI CSI-2/DSI
- FPD-LINK Receiver — Converts FPD-LINK video streams to pixel clock domain
- FPD-LINK Transmitter — Converts Pixel Data Streams to an FPD-LINK video stream
- SubLVDS Image Sensor Receiver — Converts SubLVDS image sensor video stream to pixel clock domain
- Pixel to Byte Converter — Converts pixel format data to parallel byte format for D-PHY transmitter
- Byte to Pixel Converter — Converts parallel byte format from a D-PHY receiver into pixel format
In addition, Lattice has included a 1:2 MIPI DSI Display Interface Bandwidth Reducer, which utilizes select modular IP cores above to bridge an input video stream into two streams or one lower resolution stream.
The newly expanded suite of CrossLink IP cores are readily available in the Clarity Designer tool in Lattice’s Diamond® software.
CrossLink evaluation boards with the new IP cores are available now from Lattice and its distributors. To learn more, please visit www.latticesemi.com/CrossLink.
About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) provides smart connectivity solutions powered by our low power FPGA, video ASSP, 60 GHz millimeter wave, and IP products to the consumer, communications, industrial, computing, and automotive markets worldwide. Our unwavering commitment to our customers enables them to accelerate their innovation, creating an ever better and more connected world.
For more information about Lattice please visit www.latticesemi.com.
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