"Insolvent" Tsinghua Unigroup Aims to Restructure
By Alan Patterson, EETimes (July 11, 2021)
With debts exceeding its assets, Tsinghua Unigroup has acknowledged it is insolvent. The Chinese holding company, which owns chipmakers such as Yangtze Memory Technologies Co. (YMTC) and chip designer Unisoc (Shanghai) Technologies Co., said it will attempt a restructuring.
“Creditors said that our Group cannot pay off due debts, and assets are insufficient to pay off the debts,” Tsinghua Unigroup said in a statement on its website. “The Group has obviously become insolvent.”
Tsinghua said it has applied to the Beijing No. 1 Intermediate People’s Court for reorganization. The holding company said it will cooperate with the court to conduct judicial review, promote debt risk mitigation work, and support the court to protect the legal rights and interests of creditors in accordance with Chinese law.
To read the full article, click here
Related Semiconductor IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
- PDM Receiver/PDM-to-PCM Converter
Related News
- Intel and Tsinghua Unigroup Collaborate to Accelerate Development and Adoption of Intel-based Mobile Devices
- Chinese chipmaker Tsinghua Unigroup to buy France's Linxens for $2.6 billion: sources
- Bankrupt Tsinghua Unigroup advertises for investors
- Tower Semiconductor Announces Signing and Closing of Definitive Agreements with its Lenders to Restructure Its Balance Sheet and Reduce $250 Million of Debt
Latest News
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
- Intel to Repurchase 49% Equity Interest in Ireland Fab Joint Venture
- AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees
- EnSilica selected for UK CHERI Adoption Collective
- CHIPS Alliance launches the SV Tools Project for open source development of SystemVerilog/UVM codebases