IEEE Fellow Gary Bronner Joins Rambus

Former IBM Distinguished Engineer brings exceptional experience in fundamental DRAM design

Los Altos, California, United States  -- October 12, 2006 --  Rambus Inc. (NASDAQ: RMBS), one of the world's premier technology licensing companies specializing in high-speed chip interfaces, today announced that Dr. Gary Bronner has joined Rambus to serve as Technical Director. Dr. Bronner joins Rambus following 21 years with IBM, where he led a number of programs, including the DRAM Development Alliance of IBM and Infineon, spearheading the development of all generations of IBM’s leading-edge DRAM technology and products. In addition, Dr. Bronner was the project leader of the SOI Development Alliance of IBM, AMD, Sony and Toshiba. At Rambus, Dr. Bronner will focus on memory technology development.

“Gary is highly respected in the industry for his leadership contributions in process technologies and DRAM design,” said Kevin Donnelly, senior vice president of engineering at Rambus. “Gary joins a world-class team of engineers and scientists at Rambus that have delivered tremendous value to the industry through innovations and technology foundational to nearly all digital electronic products.”

Dr. Bronner joined IBM in 1985 and has served in multiple roles across the Research Division as well as IBM’s Microelectronics Division. He received his bachelor’s degree in electrical engineering from Brown University and his master’s degree and PhD from Stanford University. He holds 64 issued patents and has published multiple technical disclosures and articles in reference journals. Dr. Bronner has received a Research Division Outstanding Contribution Award, a Division Award, an Outstanding Technical Achievement Award, a Division Excellence Award, and a Division Patent Portfolio Award.

About Rambus Inc.

Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' technology and products solve customers' most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.