IEEE approved Bluetooth-based wireless PAN standard
IEEE approved Bluetooth-based wireless PAN standard
By Patrick Mannion, EE Times
March 25, 2002 (8:54 a.m. EST)
URL: http://www.eetimes.com/story/OEG20020322S0041
MANHASSET, N.Y.In a not-unexpected move, the IEEE has approved a Bluetooth-based standard for wireless personal-area networks (WPANs). The IEEE 802.15.1 standard, which covers the media-access control and physical-layer for WPANs, is fully compatible with the latest Bluetooth v1.1 specification.
The IEEE licensed portions of the new standard from the Bluetooth Special Interest Group, and added a major clause on service access points. The added rules essentially govern how 802.15.1-compliant devices should be designed, and cover some core signaling specifications.
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related News
- Bluetooth SIG Introduces Wireless Standard for Electronic Shelf Label Market
- Ceva Unveils Ceva-Waves Links200 - A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4
- Panasonic Starts Licensing IP Core for Semiconductors Complying with the IEEE 1901-2020 International Standard
- MVSILICON License and Deploy CEVA Bluetooth IP in its latest Wireless Audio Platform
Latest News
- Logic Fruit Technologies Appoints Sunil Kar as President & CEO to Accelerate Global Growth
- EnSilica plc - Audited Results for the Year Ended 31 May 2025
- Thalia Design Automation announces AMALIA Platform release 25.3 qualified for advanced process nodes down to 4nm
- Global Semiconductor Sales Increase 15.8% from Q2 to Q3; Month-to-Month Sales Grow 7.0% in September
- Qualitas Semiconductor Expands Global Presence with 4nm UCIe and PCIe Gen 6.0 IP Licensing Agreement in the U.S. AI Market