FinFETs Race Toward Silicon
100+ tapeouts so far include 16nm TSMC chips
Rick Merritt, EETimes
3/10/2015 01:30 PM EDT
SAN JOSE, Calif. — More than 100 chips in or headed for production have taped out using FinFET-based process technologies, according to EDA tool vendor Synopsys Inc. The chips include a quad ARM Cortex-A72 device made in TSMC’s 16nm process, it said.
Synopsys claims its Galaxy Design Platform has been used by 90 percent of the production-bound FinFET chips that have taped out to date. The news was released the same day archrival Cadence Design Systems announced Innovus, its next-generation physical design tool which claims significant speed ups in FinFET and planar processes.
The news suggests TSMC and Samsung are running neck-and-neck to close the gap with Intel which has been in production with 14nm processors for several months.
To read the full article, click here
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Neural Video Processor IP
- Flash Memory LDPC Decoder IP Core
Related News
- ARC edges toward platform approach, profit
- Taiwan makes slow shift toward greater respect for IP
- Vulcan ASIC Ltd. rekindles Java core race with Moon IP
- Motorola and Altera Have Entered Discussions Toward an Embedded Processor Technology Licensing Agreement
Latest News
- Silvaco Completes Acquisition of Mixel Group, Inc. a Provider of Low-Power, High-Performance Mixed-Signal Connectivity IP Solutions
- Rapidus adopts Teamcenter for Semiconductor Lifecycle Management
- Q4 FY25 Quarterly Activities Report: Weebit Nano well-positioned to achieve 2025 commercial targets
- SiMa.ai Raises $85M to Scale Physical AI, Bringing Total Funding to $355M
- Armv9 and CSS Royalties Drive Growth in $1bn Arm Q1 Earnings