Ericsson Presents Enhanced Mobile Phone Suite 1.2
The Bluetooth Mobile Phone Suite was the first in a series of highly optimized Bluetooth design solutions introduced by Ericsson Technology Licensing last year. A new mobile phone suite is now available with support for Bluetooth 1.2 and a greater selection of add-on features. This will provide semiconductors with a highly competitive Bluetooth solution when targeting the new generation of mobile phones.
Mobile phones stand for more than 50% of all devices with Bluetooth wireless technology. Ericsson’s new suite includes market-leading Bluetooth radio and baseband IP cores and software, providing semiconductors with a complete Bluetooth 1.2 solution including high quality voice features.
“With our enhanced Mobile Phone Suite, we can offer the latest Bluetooth features combined with, for example, support for wireless streaming audio,” says Johan Åkesson, Marketing Director at Ericsson Technology Licensing. “We have already seen an increased interest in more advanced Bluetooth features from mobile phone OEM’s. Our new suite fully meets these new requirements.”
Other suites include Bluetooth PDA Suite, Bluetooth Headset Suite and Bluetooth HID Suite.
High quality voice features:
- Integrated software algorithm for echo cancellation
- PPEC voice correction technology
- Adaptive Frequency Hopping
- Extended SCO
Our mobile phone suite enables key Bluetooth applications
- Streaming multimedia
- Synchronization
- Sending and receiving files, images and objects
- Mobile gateway with WAN and LAN connections
- Automotive applications
- Java applications
About Ericsson Technology Licensing
Ericsson Technology Licensing develops state-of-the-art Bluetooth design solutions optimized for mobile communication, computing and media devices. As a major driving force behind the Bluetooth initiative, we have been instrumental in the development of Bluetooth wireless technology from a simple idea into a widely acclaimed industry standard. Our complete portfolio of IP Cores for Bluetooth baseband and radio together with a complete Bluetooth software package, qualification services, training and design services provides semiconductor and original equipment manufacturers the fastest, most reliable course for implementing Bluetooth wireless technology in new products.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Ericsson sues UK based mobile phone company Sendo for patent infringement
- NTT DoCoMo, Renesas, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson to Jointly Develop Platform for 3G Mobile Phone Handsets
- Renesas Technology Starts Sample Shipments of SH-Mobile G3 System LSI Jointly Developed With NTT DoCoMo, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson for 3G Mobile Phone Handsets
- Open-Plug powers the new J132 mobile phone from Sony Ericsson
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack