Dolphin Integration launches a standard cell library with ultra-high density up to 30% savings
-- Dolphin Integration is up to their charter as the most adaptive creator in Microelectronics to "Enable mixed signal Systems-on-Chip", with a quality management enabling reactivity for innovation.
Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, resilient to noise and drastic for low power-consumption, together with engineering assistance and product evolution customized to their needs.
SoC providers targeting the market of portable electronic devices and of highly complex SoCs mainly care about 2 major concerns: minimization of silicon costs and low power consumption.
This new library, SESAME uHDvLC, referring to its ultra High Density and very Low power Consumption – provides area savings up to 30%, while enabling power reduction up to 50%, compared to competition.
Of course SESAME uHDvLC benefits from the increasing advantages of a RCSL (Reduced Cell Stem Library):
- Highly customizable for specific designs
- A high design yield and reliability prior to Silicon thanks to a thorough Virtual Fab Process™
- A reduced time to market for processes besides mainstream
SESAME uHDvLC is the solution of choice for Mobile Phone, PDA, Portable Multimedia Players, Digital Camera and GPS.
Immediately available at TSMC 180, and readily ported to other technological processes, SESAME uHDvLC benefits from a unique « Try and Buy tutorial » for guiding its evaluation, not only for free, but for fun!
More information on http://www.dolphin.fr/flip/sesame/sesame_overview.html
Related Semiconductor IP
- HBM4 PHY IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- HBM4 Controller IP
- IPSEC AES-256-GCM (Standalone IPsec)
Related News
- Dolphin Integration enable Dongbu HiTek's users to benefit from their ultra high density standard cell library
- Ultra high density standard cell library SESAME uHD-BTF to enrich Dolphin Integration's panoply at TSMC 90 nm eF and uLL
- Dolphin Integration breakthrough innovation for TSMC 180 nm BCD Gen 2 process: Up to 30% savings in silicon area with the new SpRAM RHEA
- Dolphin Integration enables 1P3M/1P4M SoC designs at 180 nm with their ultra high density standard cell library
Latest News
- AI Directs UFS Advancement
- Qualitas Semiconductor Expands Automotive Momentum with 5nm IP Bundle Agreement
- Cyient Semiconductors Acquires Majority Stake in Kinetic Technologies to Drive Custom Power IC Leadership for Edge AI and High-Performance Compute Markets
- Rivian Unveils Custom Silicon, Next-Gen Autonomy Platform, and Deep AI Integration
- NanoXplore raises €20 million from MBDA and Bpifrance to accelerate its diversification into defense and its growth in support of European strategic sovereignty