Vendor: Cadence Design Systems, Inc. Category: DSP Core

Tensilica DSP IP supports efficient AI/ML processing

The Cadence AI IP platform includes the extensible DSP platform from Cadence, which provides flexible instruction sets designed t…

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Overview

The Cadence AI IP platform includes the extensible DSP platform from Cadence, which provides flexible instruction sets designed to perform artificial intelligence and machine learning (AI/ML) workload operations efficiently. Mixing AI and DSP workloads in a single application is easy with Tensilica DSPs.

The Tensilica AI Base platform offers 8 GOPS to up to 2 TOPS of AI performance and includes the popular Tensilica HiFi DSPs for audio/voice, Vision DSPs, and ConnX DSPs for radar and communications. The DSPs are based on the VLIW and SIMD architectures, with instruction sets optimized for specific domains, including extensions for AI. Customers benefit from the domain-specificity, extensibility, and configurability they have come to expect from the trusted, mature Tensilica DSP architecture. SoC designers can extend the base architecture to address specific workload requirements and create differentiation. These DSPs also offer a scalable multiplier accumulator (MAC) block that can run custom AI workloads efficiently, as well as an optimized NN library and comprehensive software support.

Key features

  • Powerful DSP Instruction Set Supporting AI/ML Operations.
    • Highly scalable IP portfolio, with AI Base built on successful and power-efficient domain-specific DSPs.
  • Mixed Workloads.
    • AI/ML processing can seamlessly combine with DSP in a unified application.
  • Industry-Leading Performance and Power Efficiency.
    • High Inferences per second per area (IPS/mm2) and per power (IPS/W).
  • End-to-End Software Toolchain for All Markets and a Large Number of Frameworks.
    • NeuroWeave SDK provides a common tool for compiling networks across IP, with flexibility for performance, accuracy, and run-time environments.

What’s Included?

  • Free Software Evaluation
    • Try our SDK Software Development Toolkit for 15 days absolutely free. We want to show you how easy it is to use our Eclipse-based IDE.
  • Online Support:
    • The Cadence Online Support (COS) system fields our entire library of accessible materials for self-study and step-by-step instruction.
  • Xtensa Processor Generator (XPG):
    • The Xtensa Processor Generator (XPG) is the heart of our technology - the patented cloud-based system that creates your correct-by-construction processor and all associated software, models, etc. (Login Required)
  • Technical Forum Access:
    • Find community on the technical forums to discuss and elaborate on your design ideas.

Files

Product Sheet Download

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Specifications

Identity

Part Number
Tensilica AI Base
Vendor
Cadence Design Systems, Inc.
Type
Silicon IP

Provider

Cadence Design Systems, Inc.
HQ: USA
If you want to achieve silicon success, let Cadence help you choose the right IP solution and capture its full value in your SoC design. Cadence® IP solutions offer the combined advantages of a high-quality portfolio, an open platform, a modern IP factory approach to quality, and a strong ecosystem. Now you can tackle IP-to-SoC development in a system context, focus your internal effort on differentiation, and leverage multi-function cores to do more, faster. The Cadence IP Portfolio includes silicon-proven Tensilica® IP cores, analog PHY interfaces, standards-based IP cores, verification IP cores, and other solutions as well as customization services for current and emerging industry standards. The Cadence IP Factory provides you with an automated approach to the customization, delivery, and verification of SoC IP. As a result, you can spend more time on differentiation, with the assurance that you'll meet your performance, power, and area requirements. Choosing Cadence IP enables you to design with confidence because you have more freedom to innovate your SoCs with less risk and faster time to market.
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Learn more about DSP Core IP core

icyflex: an ultra-low power DSP core for portable applications

The icyflex family of ultra low power 16/32-bit RISC processor cores developed by CSEM offers a flexible architecture that allows for different com-binations of control and DSP functionality. These processors target applications requiring long battery life at the same time as on-chip processing power. Three silicon-proven icyflex cores are available, consuming as little as 6 μW/MHz.

Frequently asked questions about DSP Core IP cores

What is Tensilica DSP IP supports efficient AI/ML processing?

Tensilica DSP IP supports efficient AI/ML processing is a DSP Core IP core from Cadence Design Systems, Inc. listed on Semi IP Hub.

How should engineers evaluate this DSP Core?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DSP Core IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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