IP Set for Miniaturized Telehealth Wearables
HealthIP™ is targeting portable health monitoring (telehealth/telemedicine) and wearable health monitoring devices.
Overview
HealthIP™ is targeting portable health monitoring (telehealth/telemedicine) and wearable health monitoring devices. The IP set contain analog front-ends’ hard macro and synthesizable HDL with optional multicore 32-bit RISC MCU. The whole IP is silicon proven in CMOS 130 nm. Engineering samples available in QFN80 package with development board.
Key features
- electrocardiography (ECG)
- electromyography (EMG)
- skin temperature and resistance
- respiration rate
- oxygen saturation (SpO2)
- analyze health parameters (32-bit RISC MCU)
- digital interfaces: UART, SPI, I2C, CAN, Ethernet
Block Diagram
Applications
- Analyze health parameters during sport
- Monitor people working in harsh and demanding conditions or in remote and inaccessible locations, such as: pilots, drivers, firefighters, miners, heavy machinery operators
- Elderly people portable monitoring
- Children and newborns portable monitoring
What’s Included?
- Datasheet/Integration Guide
- GDSII database/LVS & SPICE netlist
- HDL Model/Footprint (.LEF)
- IP implementation support, 6 months maintenance (delivery of the IP and documentation up-dates)
Files
Note: some files may require an NDA depending on provider policy.
Specifications
Identity
Provider
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Frequently asked questions about Mixed-Signal Subsystem IP cores
What is IP Set for Miniaturized Telehealth Wearables?
IP Set for Miniaturized Telehealth Wearables is a Mixed Signal Subsystem IP core from ChipCraft listed on Semi IP Hub.
How should engineers evaluate this Mixed Signal Subsystem?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Mixed Signal Subsystem IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.