Learn more about DLL IP core
As SoCs evolve to support a growing range of memory interfaces, designers are faced with the challenge of balancing integration complexity, pin efficiency, and performance scalability. Traditionally, implementing both xSPI (JESD251) for boot and eMMC 5.1 for high-speed storage required separate PHYs, leading to increased silicon area, power consumption, and I/O overhead.
Systems using SoCs designed in advanced processes generally rely on external Flash devices that use NOR/NAND Flash memory technology for non-volatile storage. NOR Flash memory offers many benefits for device manufacturers and consumers, such as faster reading, low power consumption, and smaller area. In contrast, NAND Flash memories are ideal for applications such as data storage, where higher memory capacity and faster write and erase operations are required.
In recent years, emerging industries such as AI, Internet of Things, 5G, and intelligent networked vehicles have flourished, and the high requirements for performance have greatly increased the scale and complexity of chips, constantly challenging IP limitations.
In this fifth and last part of Paving the way for the next generation audio codec for True Wireless Stereo (TWS) applications whitepaper, a hastened but safe and improved design flow by Dolphin Design will be discussed.
Despite the fears of the last decade that Moore’s Law had finally reached its end, the microelectronics sector has continued to adapt to new physical constraints and product requirements through sustained innovation and creativity. A major portion of that creative energy has gone into the development of analog, RF and mixed-signal blocks as embeddable IP.
