TSMC Opens Office in India
- Taiwan Semiconductor Manufacturing Company, Inc. (TSE: 2330, NYSE: TSM) today announced that it has opened an office in Bangalore, India. The officeâs primary mission is to locally support existing TSMC customers in North America, Europe and Asia with design activities in India as well as to help new fabless companies in India to grow and expand by leveraging TSMCâs worldwide resources. With more than 100 advanced technology design centers in India, the office will enable the efficient completion of designs, thereby improving time to market and time to revenue for TSMC customers.
"We wanted to keep a pulse on what is going on in India, as thereâs been a huge increase in the number of advanced technology designs coming from that region. This office will help our customers quickly and seamlessly get their designs into manufacturing at TSMC and into the hands of their customers,â said Sajiv Dalal, Business Development Director for TSMC North America. âTSMC recognizes the potential of the region and is opening an office as a part of its ongoing charter to develop the semiconductor ecosystem.â
The new office is headed by Ashwin Ramachandran and is located at 1st Floor, Pine Valley, Embassy Golf-Links Business Park, Bangalore â 560071, INDIA.
About TSMC
TSMC is the worldâs largest dedicated semiconductor foundry, providing the industryâs leading process technology and the foundry industryâs largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2006 exceeded seven million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs, four eight-inch fabs, and one six-inch fab. TSMC also has substantial capacity commitments at its wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 65nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Test and Verification Solutions opens its branch office at Bengaluru, India
- Alphawave Semi Opens Pune Office, Continues Expansion into India
- AI Edge Inference IP Leader Expedera Opens R&D Office in India
- Nordic Semiconductor opens regional sales office in Tokyo to further enhance its presence in the Japanese market and provide support for its existing local distributors
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack