TransDimension, a leading provider of USB connectivity solutions for embedded applications, strengthens Japan sales organization through expanded partnership with Memec
Relationship Provides Distribution, Logistics, Sales and Applications Support for USB Connectivity Solutions
IRVINE, Calif., May 3, 2004 - TransDimension, a leading provider of USB connectivity solutions for embedded applications, today announced that TransDimension has expanded its relationship with MEMEC to include support for Japan in addition to Europe. MEMEC, a global semiconductor distributor, will immediately begin to provide technical sales and distribution/logistical support. TransDimension has expanded its Japanese market presence in response to significant market acceptance of its USB connectivity semiconductor and software solutions.
"We are very excited to extend our relationship with MEMEC to enhance our international sales strategy into Japan," said Pete Todd, TransDimension vice president of sales. "MEMEC's experience and expertise in semiconductor demand creation, technical support and logistics will allow us to better service our Japanese customer base. In addition, we plan to leverage their strong customer relationships to market our USB solutions to Japanese customer prospects."
TransDimension's product lines include ICs (semiconductors), IP cores and software that provide direct connectivity for a wide range of PC peripheral, consumer and mobile devices that until now have required an indirect means, such as a PC host, to exchange data. These embedded applications include cellular phones, set top boxes, printers, PDAs, digital cameras, portable storage products and CD, DVD and MP3 players.
"USB/OTG connectivity is critical for many of our consumer, industrial and telecom customers; and TransDimension is a market leader with its USB connectivity solutions," commented Chris Norman, president and CEO, MEMEC Japan. "Adding TransDimension to our product portfolio allows MEMEC Japan to offer a complete USB solution including both hardware and software, which is very much a need of our customer base in Japan."
About MEMEC
MEMEC, through its operating subsidiaries, is a leading global semiconductor distributor focused on creating demand for its suppliers' proprietary products at original equipment manufacturers (OEMs). MEMEC's three core demand creation selling organizations Insight, Unique, and Impact each use a specialized team of field application engineers who are equipped with superior product knowledge to help design their suppliers' proprietary semiconductors into new OEM products. The company utilizes a multidivisional sales approach within each of these subsidiaries to create and fulfill demand for a finite number of non-competing supplier partners. Additionally, each of these selling organizations has the ability to tap into MEMEC Design's programmable logic engineering services, ASIC design, and FPGA and IP core development to provide OEM customer's outsourced design and engineering services. For larger OEMs and those who outsource the manufacturing of their products to third party contract electronics manufacturers (CEMs), MEMEC United will provide supply chain management solutions and product fulfillment services. Another MEMEC subsidiary is MEMEC Express, which utilizes outbound/inbound telemarketing to effectively and efficiently reach smaller OEMs. All the MEMEC companies share common services including warehousing, logistics, IT, HR, and Finance. More information can be found at http://www.memec.com
About TransDimension
Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market solutions targeting peripheral connectivity. TransDimension's product lines include the integrated circuits, IP cores and USB software stacks that enable direct connectivity and I/O for a wide range of applications and mobile devices. Until now, these products have required an indirect means, such as a PC host, for exchanging data. TransDimension's SoftConnex USB software is a complete software solution for USB, including the broadest OS and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension and SoftConnex can be found at http://www.transdimension.com
# # #
Related Semiconductor IP
- RISC-V CPU IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
Related News
- Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications
- Ceva Expands its Market Share Leadership in Wireless Connectivity IP, Strengthening its Solutions for Smart Edge AI/IoT applications
- SoC architecture and IP provider Sonics expands to Japan with dedicated office to support local customers
- Arteris Strengthens Technical Organization in the U.S.; Veteran Tool Development and Application Executives Join Arteris to Accelerate Delivery of Network on Chip (NoC) Products
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers