TI's multicore software development kit extended to low-power DSP + ARM devices
MCSDK now available on OMAP-L138 DSP + ARM9 low-cost development kit, reducing development time and enabling scalability to high-performance DSPs
DALLAS, Nov. 13, 2013 -- Texas Instruments (TI) (TXN) today announced the availability of its Multicore Software Development Kit (MCSDK) on the low-power OMAP-L138 and OMAP-L132 DSP + ARM9™ processors, offering developers reduced development time and scalability to TI's TMS320C6000™ high-performance digital signal processors (DSPs). Customers developing applications for industrial, communications, telecom and medical markets can now migrate to high-performance devices without moving to another software platform.
TI's MCSDK provides highly-optimized bundles of foundational, platform-specific drivers to enable development on TI's devices. Providing well-defined application programming interfaces for ease of programming, the MCSDK supports future portability to higher performance TI multicore platforms so that customers do not have to develop common layers from scratch. The MCSDK gives developers the ability to evaluate hardware and software capabilities of the device-specific development platforms and to rapidly develop multicore applications. In addition, it enables applications to use SYS/BIOS and/or Linux® on one platform. Typically the MCSDK individual cores can be assigned to operate Linux applications as a control plane while other cores are simultaneously assigned high-performance signal processing operations. This heterogeneous configuration provides software developers the flexibility to implement full solutions on TI's multicore processors. In the case of TI's OMAP-L138, the internal ARM9 processor can be assigned with a high-level operating system, such as embedded Linux, performing complex IO stack handling, while the TMS320C647x DSP runs TI RTOS (previously SYS/BIOS) real-time processing tasks.
"We are very excited to have the MCSDK available for the OMAP-L138 processor," said Ramesh Kumar, business manager, DSP at TI. "New and existing customers will enjoy many benefits, including the ability to use the same software across TI's C6000™ DSPs, enabling programming efficiency, improved time to market and a greater return on investments made today."
The MCSDK contains libraries that are compatible with TI's C647x DSPs and KeyStone-based DSPs including the C665x, C667x, 66AK2Hx and 66AK2Ex processors. With the MCSDK, developers are able to access and benefit from various optimized DSP libraries including the Math Library, Digital Signal Processing Library, Image and Video Processing Library, Telecom Libraries and Speech and Video Codecs. In addition, TI's OMAP-L138 processor is packed with a unique combination of application-tuned features and peripherals including Ethernet, USB, SATA, Video Port Interface (VPIF), uPP and more.
Access to a well-established, large ecosystem of support
TI's MCSDK gives developers access to the latest Linux software updates through the community open-source kernels. Additional Linux support and expertise is also available through TI's extensive network of Linux consulting partners on the TI E2E™ Support Community.
Availability & Pricing
Download TI's MCSDK for the OMAP-L138 processor for free on TI.com. For an easy to use, low-cost development kit to jumpstart your development, purchase the OMAP-L138 LCDK (TMDXLCDK138) development kit available for $195.00 through the TI eStore or through distribution partners.
For more information:
- Read about TI's OMAP-L138 and OMAP-L132 processors as well as the OMAP-L138 LCDK
- Read about and download the MCSDK for OMAP-L138 processor
About Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.
Related Semiconductor IP
- RISC-V CPU IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
Related News
- Quadric's DevStudio Speeds Software Development with Industry's First Integrated ML + DSP Cloud-Based Code Development Platform
- OpenHW Group Announces Tape Out of RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software
- Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development
- Altera and TI make RF design fast and easy with complete development kit for Arria V FPGAs
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers