Huang "Confident" Nvidia-Arm Deal Will Get Past Regulators
By Sally Ward-Foxton, EETimes (October, 8, 2020)
Nvidia CEO Jensen Huang is confident that the Nvidia-Arm deal, the biggest in semiconductor history at $40 billion, will get past global regulators. Speaking during a “fireside chat” as part of Arm Dev Summit, the company’s developer conference, Huang said that the two companies are complementary and as such, the acquisition would drive innovation forward and be good for customers.
“I am confident. We are confident that [the Nvidia-Arm deal] is going to go through,” Huang said. “As soon as we explain the rationale of the transaction and our plans to regulators around the world, they will realize that these are two complementary companies.”
Arm CEO Simon Segars backed Huang up, while noting that the regulatory process will take some time.
“This is a deal that’s about expanding,” Segars said. “It’s about creating more and new technology. It’s about putting that technology in the hands of people who are going to build really cool stuff with it. So from that point of view, this is about enabling more people to do more things. That’s the positive thing, that as regulators do scrutinize this, they’re going to be able to see.”
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Nvidia-Arm Deal Would Be a Technology "Disaster"
- Objections grow to Nvidia-ARM deal
- China lawsuits threaten Nvidia-Arm deal
- Nvidia-ARM deal runs into security issues in the UK
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack