Infineon Technologies: Advanced 65nm mobile phone chip works first time - 30 million transistors integrated on one cell phone key
Munich, May 12, 2006 – Infineon Technologies AG announced today that the first cell phone chips equipped with its advanced 65-nm CMOS process technology are now available. The components functioned perfectly right from the start, as complicated testing in Duisburg, Munich and Bangalore, India has now shown. The dial-in to different GSM mobile communications networks and the resulting connections worked without a hitch. This new technology features high performance at low power consumption and is the most advanced semiconductor technology for logic circuitry that Infineon is currently preparing for mass production. First products in this new technology are expected to be market-ready towards the end of 2006.
”The data available today emphasizes the multifold strengths of our alliance strategy resulting in a leading position towards time-to-market, figure-of-merits, and manufacturing flexibility by pooling significant R&D resources and also exploiting a huge amount of intellectual capital,” said Prof Dr Hermann Eul, member of the Infineon Management Board and head of the Infineon Communication Solutions Business Group. “Thanks to this technological breakthrough, we have proven that our strategy of innovative integration works and that the number of available functions will increase while the footprint decreases.”
The chip just tested puts more than 30 million transistors on a space of just 33mm² and proves that Infineon is able to produce such major digital and analog circuitry in cell phones as MCU/DSP cores, storage and analog/mixed-signal in 65-nm technology to operate with high reliability. This space-saving technology was also used to manufacture high-frequency circuits for the first time.
Infineon developed this technology in the leading 65/45-nm research and development alliance ICIS consisting of IBM, Chartered, Infineon and Samsung. The mobile communications chip developed by Infineon was produced in the frame of a manufacturing agreement with Chartered in Singapore.
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for automotive, industrial and multimarket sectors, for applications in communication, as well as memory products through its subsidiary Qimonda. With a global presence, Infineon operates through its subsidiaries in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2005 (ending September), the company achieved sales of Euro 6.76 billion with about 36,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com. Further information on Qimonda is available at www.qimonda.com.
Related Semiconductor IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
- High Speed Ethernet 2/4/8-Lane 200G/400G PCS
Related News
- Infineon to Enter Ultra-Wideband Market with Industry's First Dual-Band RF-CMOS Transceiver Core - Paving the Way for the Converged Entertainment Cell Phone
- Infineon's Multimedia Phone Platform for GSM/GPRS Used in Latest Mobile Phones of Panasonic Mobile Communications
- Agere Systems Announces Low-Cost Cell Phone Platform for the Market's Largest Segment
- Jazz Semiconductor's Optimized SiGe Technology Targeted at Replacing GaAs Components in Growing Millimeter Wave and Cell Phone Markets
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers