Arteris Announces Support For New ARM AMBA 4 Interconnect Specification
Interoperability Support Between AMBA 4-compliant IP cores and Interconnect and Arteris Network on Chip (NoC) SoC Class Interconnect Products Maximize Performance and Power Efficiency
SAN JOSE, Calif. -- March 18, 2010-- Arteris, Inc., a leading interconnect IP solutions provider, today announced support for the new ARM(R) AMBA(R) 4 specification. Arteris and ARM are working together to ensure interoperability between the AMBA 4 AXI(TM) 4 interface protocol and the Arteris Network on Chip (NoC), and are partnering to deliver optimal system performance for SoC designers using AXI4 protocol-compliant IP together with Arteris NoC interconnect technology.
"Our goal is to ensure the broadest adoption of the AMBA 4 specification into existing and emerging product markets," said Michael Dimelow, ARM's Director of Marketing, Processor Division. "Arteris NoC technology brings together a wide range of SoC communication capability, together with our IP and interconnect products."
"With this relationship, Arteris gains deep access to current and future developments of the AMBA 4 specification," said Charlie Janac, President of Arteris. "In addition to seamless integration, the Arteris NoC technology delivers value to SoC makers through low power, fewer wires, low latency and high bandwidth coupled with an automated design and verification tool-set that accelerates time to market."
About Arteris
Arteris, Inc. provides semiconductor interconnect IP, and tools to improve communication performance of ICs for a wide range of applications. Results obtained by using the Arteris IP product line include lower power, higher performance, efficiency of development and faster delivery of simple to complex ICs, SoCs and FPGAs.
Founded by networking experts, Arteris operates globally with headquarters in San Jose, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at http://www.arteris.com
Related Semiconductor IP
- HBM4 PHY IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- VIP for Compute Express Link (CXL)
Related News
- ARM AMBA 4 Specification Maximizes Performance and Power Efficiency
- Mentor Graphics Adds AMBA 4 Verification IP to the Questa Multi-view Verification Components Library
- Sonics Announces Support for AMBA 4 Specification
- Xilinx ISE Design Suite 12.3 Introduces AMBA 4 AXI4 IP Cores, Enhances PlanAhead Design and Analysis Cockpit, Extends Power Optimization
Latest News
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract
- TSMC to Lead Rivals at 2-nm Node, Analysts Say
- Energy-efficient RF power modules developed using SOI technology