Overview
The USB 3.0 PHY IP Core is a transceiver provided for supplementary devices, compliant with UTMI (USB SuperSpeed), USB 3.0, and USB 2.0 PIPE requirements. With minimal power consumption and chip area requirements, the USB3.0 PHY IP transceiver doesn't sacrifice speed or data throughput. The USB3.0 PHY IP offers complete support for high-performance designs by offering an integrated self-test module with integrated jitter injection, a dynamic equalization circuit, and a complete on-chip physical transceiver solution with Electrostatic Discharge (ESD) protection. Multiple IP sources can use the same PHY interface (PIPE) thanks to the USB3 MAC layer. Constant power, integrated Jitter Injection Output, integrated Self-Test, and approved customization of analog circuit characteristics remove internal test monitoring and jitter.
Provider
T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets.
T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules.
With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.
Learn more about Single-Protocol PHY IP core
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Universal Flash Storage (UFS) was created for mobile applications and computer systems requiring high performance and low power consumption. These systems typically use embedded Flash based on the JEDEC standard eMMC. UFS was defined by JEDEC as the evolutionary replacement for eMMC offering significantly higher memory bandwidth. The standard builds on existing standards such as the SCSI command set, the MIPI Alliance M-PHY and UniProSM as well as eMMC form factors to simplify adoption and development.
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