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Semiconductor IP News Archive - Page 45 of 265
聯電推出40奈米RFSOI平台 加速5G毫米波應用
2023-05-03 13:30:00
Foundries & Process Nodes
Alphawave Semi 展示用于高性能数据中心应用的 3nm 连接解决方案以及支持小芯片的平台
2023-04-26 16:27:00
IP Cores & Design
Tenstorrent在其AI 高性能计算和数据中心 RISC-V 小芯片中选用 Arteris IP
2023-05-02 14:48:00
Commercial Deals
BrainChip凭借Akida Innovations在 2023 年打破边界扩大合作伙伴生态系统
2023-05-02 08:20:00
Misc
GlobalFoundries完成购买纽约制造厂附近的800英亩土地
2023-05-01 08:21:00
Foundries & Process Nodes
M31携手TSMC 7/5奈米先进制程 展现高速接口IP研发成果
2023-04-27 16:46:00
IP Cores & Design
芯动科技风华GPU蝉联“年度行业突出贡献奖”
2026-06-28 04:27:14
Misc
台積公司舉辦2023年技術論壇 會中揭示全新技術發展
2023-04-27 16:52:00
Foundries & Process Nodes
Cadence 定制设计迁移流程加速现可支持 TSMC N3E 及 N2 工艺技术
2023-04-27 16:25:00
EDA & Design Tools
T2M发布快速锁定Fractional PLL IP设计,具备SSC功能,性能优异。可移植到各工艺节点上
2023-04-24 01:00:00
Misc
Cadence 宣布与 SK 海力士速度最高的 9600Mbps LPDDR5T 移动 DRAM 可实现互操作性
2023-04-18 07:00:00
IP Cores & Design
Cadence 发布基于台积电 N4P 工艺的下一代 112G 超长距离 SerDes IP,加快超大规模系统级芯片设计
2023-04-25 04:21:00
IP Cores & Design
Cadence 成功流片基于台积电 N3E 工艺的 16G UCIe 先进封装IP
2023-04-25 05:10:00
IP Cores & Design
新思科技和台积电联手合作优化台积电 N2 工艺上的EDA 流程,加速启动设计
2023-04-25 14:05:00
EDA & Design Tools
Agile Analog推出创新的数字包装模拟IP子系統
2023-04-25 09:27:00
IP Cores & Design
Analog Bits将在台积电 2023 北美技术研讨会上展示支持台积电 N3E 工艺IP
2023-04-25 04:13:00
Misc
Attopsemi 革命性 I-fuse® OTP 成功完成FinFET 技术硅验证
2023-04-25 05:51:00
IP Cores & Design
OPENEDGES的12纳米LPDDR5/4内存子系统IP驱动创新,已授权给ASICLAND使用
2023-04-25 05:44:00
Commercial Deals
Cadence 推出开创性人工智能 Virtuoso Studio, 释放模拟、定制及 RFIC 设计的未来
2023-04-20 16:46:00
EDA & Design Tools
台積公司2023年第一季每股盈餘新台幣7.98元
2023-04-20 16:46:00
Financials
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