Vendor: T2M GmbH Category: Wi-Fi

Wi-Fi 802.11 ax/Wi-Fi 6 /Bluetooth LE v5.4/15.4-2.4GHz RF Transceiver IP for IOT Application in TSMC22 ULL

Our IP is Fully compliant with 2.4GHz IEEE 802.11ax(WIFI 6) and Bluetooth standards, this WiFi 802.11 ax(WiFi ax)/Bluetooth LE v5…

TSMC 22nm ULL View all specifications

Overview

Our IP is Fully compliant with 2.4GHz IEEE 802.11ax(WIFI 6) and Bluetooth standards, this WiFi 802.11 ax(WiFi ax)/Bluetooth LE v5.4/15.4, 2.4GHz RF Transceiver IP is available in TSMC22ULL(Ultra-low power) process node for the development of Ultra-low power IoT (Internet of Things) connectivity chipsets.
This WiFi ax/BLE/15.4 RF IP supports 20 and 40 MHz of Bandwidth with SISO architecture and can be scaled to higher MIMO configurations

The IP integrates all functional blocks including PA, Fully integrated transceiver, receiver, Frac-N frequency synthesizer, PMU & Interfaces and LO chain, and all the supporting blocks such as bias and SPI. The RF IP Core is optimized for ultra-low power and minimal die area for low-cost / low-power IoT applications such as wearables, logistics, smart homes, smart lighting, sensors, appliances, etc. Wi-Fi 802.11ax, also known as Wi-Fi 6, enhances higher throughput area and is a significant improvement over its predecessors in terms of range, throughput, and improved power efficiency. Wi-Fi Ax handles client density more efficiently through a new channel-sharing capability that promises true multi-user communications on both the downlink and uplink.

The IP also includes DFE and DPD RTL.

Key features

  • Metal Layer- 1P7M, 4X1Z1U
  • BW support for 20/ 40MHz
  • Supports 256 QAM (quadrature amplitude modulation)
  • Max Tx output power: +20dBm
  • Supports dual-mode BT/BLE
  • Very small die-size area
  • Integrated 12-bit ADC/DAC
  • Self-calibrating gain/offset
  • Integrated LDOs
  • Very low power consumption
  • Direct-conversion receiver architecture
  • Easily scalable to other MIMO configurations
  • Supports DPD
  • Operating temperature: 40?C – 85?C
  • Dual supplies: 1V and 3.3V
  • Integrated PA and switch

Block Diagram

Applications

  • Low-power IoT application
  • Smart building automation with many devices
  • Low-power sensor networks

What’s Included?

  • Source Code of Design Data Base with rights to modify
  • Schematics
  • Layout
  • Source Code
  • Certification Certificates
  • KGD

Files

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 22nm ULL

Specifications

Identity

Part Number
802.11 ax + BLEv5.4 +15.4, 2.4 GHz RF Transceiver IP for IoT
Vendor
T2M GmbH

Provider

T2M GmbH
T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets. T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules. With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.

Learn more about Wi-Fi IP core

Frequently asked questions about Wi-Fi IP cores

What is Wi-Fi 802.11 ax/Wi-Fi 6 /Bluetooth LE v5.4/15.4-2.4GHz RF Transceiver IP for IOT Application in TSMC22 ULL?

Wi-Fi 802.11 ax/Wi-Fi 6 /Bluetooth LE v5.4/15.4-2.4GHz RF Transceiver IP for IOT Application in TSMC22 ULL is a Wi-Fi IP core from T2M GmbH listed on Semi IP Hub. It is listed with support for tsmc.

How should engineers evaluate this Wi-Fi?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Wi-Fi IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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