Vendor: T2M GmbH Category: Audio Codec

LC3plus Audio Codec IP for Bluetooth LE Audio

The LC3plus audio codec is a optimized and efficient audio codec introduced for Bluetooth LE Audio, DECT and VoIP that dramatical…

Contact Provider Request Datasheet

Overview

The LC3plus audio codec is a highly optimized and highly efficient audio codec introduced for Bluetooth LE Audio, DECT and VoIP that dramatically improves streaming audio quality, reduces power, improves bandwidth and delivers ultra-low latency down to 5ms. The LC3plus audio codec has also received the Hi-Res Audio Wireless certification logo issued by the Japan Audio Society (JAS) for its ability to reproduce 40KHz frequencies when running at 96KHz with 24bit samples.

Our LC3plus and LC3 audio codecs are fixed point production proven implementations supporting all mandatory and optional features

LC3 Codec Development Status

The LC3 Codec Design is ready to license and available for the following CPUs/DSPs
• ARM® M4
• RISC-V
• HiFi® 3/5
• Qualcomm® Kalimba™ DSP
• Proprietary DSPs*

Key features

  • All Sampling Frequencies (8kHz, 16 kHz, 32 kHz, 44.1 kHz, and 48 kHz, For high-resolution Mode LC3 Plus also supports 96 kHz)
  • Supports 16, 24, and 32 bits per audio sample
  • Supports 2.5ms, 5 ms and 10ms frame interval
  • Supports 20 to 400 bytes per frame and channel for 10 ms
  • Supports 20 to 200 bytes per frame and channel for 5 ms
  • Supports 20 to 100 bytes per frame and channel for 2.5 ms
  • LC3plus decoder accepts up to 400 bytes per frame independent of frame duration
  • Packet Loss Concealment as defined in LC3 Plus specification
  • Error correction modes are available
  • No restrictions with number of supported channels.

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Specifications

Identity

Part Number
LC3plus Audio Codec IP
Vendor
T2M GmbH

Provider

T2M GmbH
T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets. T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules. With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.
Contact T2M GmbH

Learn more about Audio Codec IP core

Paving the way for the next generation audio codec for the True Wireless Stereo (TWS) applications - PART 1 : TWS challenges explained

The audio market for wireless Bluetooth headsets is growing rapidly. Audio devices using Bluetooth (BT) connectivity are more ubiquitous than ever. People have gotten used to wireless audio systems, and the mobile phone industry is pushing towards a world without audio connectors and cables. The latest trend in wireless headsets and speakers is True Wireless Stereo systems (TWS), consisting of two independent units that are each charged in their own charging case.

Frequently asked questions about Audio Codec IP cores

What is LC3plus Audio Codec IP for Bluetooth LE Audio?

LC3plus Audio Codec IP for Bluetooth LE Audio is a Audio Codec IP core from T2M GmbH listed on Semi IP Hub.

How should engineers evaluate this Audio Codec?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Audio Codec IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

×
Semiconductor IP