Amplifier linearization promotes efficiency in multi-carrier WCDMA basestation
Amplifier linearization promotes efficiency in multi-carrier WCDMA basestation
Vendor:
Omni Design Technologies, Inc.
Category:
Amplifier
High Drive Strength Voltage Buffer on TSMC 16 FFC
The ODT-OBF-ULP-DC-16FFCT is a voltage buffer with a high drive capability and is stable up to a 1nF output load.
Overview
The ODT-OBF-ULP-DC-16FFCT is a voltage buffer with a high drive capability and is stable up to a 1nF output load. It can be used to daisy-chain voltages between different AFEs and different SoCs.
The ODT-OBF-ULP-DC-16FFCT is powered by a 1.8V analog supply and a 0.8V digital supply.
Key features
- TSMC 16/12nm FFC
- Output voltage buffer
- ±2.5mV 3σ voltage accuracy
- Current sink capability of 2mA
- 1nF drive capability
Block Diagram
ODT-OBF-ULP-DC-16FFCT block diagram
Benefits
- High Performance Low Power, Low Area
Applications
- General purpose voltage buffer
- Data converter reference buffer
What’s Included?
- Datasheet
- Hard GDS Database (GDSII)
- Characterization Report (as applicable)
- Abstract View (LEF) for top level connectivity
- Behavioral Model (as appropriate)
- Integration and Customer Support
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 16nm | FFC | — |
Specifications
Identity
Part Number
ODT-OBF-ULP-DC-16FFCT
Vendor
Omni Design Technologies, Inc.
Type
Silicon IP
Provider
Omni Design Technologies, Inc.
HQ:
USA
Omni Design Technologies, Inc. is a developer of disruptive, ultra-low power semiconductor embedded circuits (IP Cores), including ultra-low power analog circuits, highly-efficient interface circuits and connected sensors. Our patented and proprietary technology offers solutions that use dramatically lower power and provide superior performance, architected from the ground up to take advantage of deep sub-micron CMOS processes. Omni Design’s mission is to provide a wide range of ultra low-power, high performance embedded circuits configured to enable highly-differentiated semiconductor systems and plug-and-play system-on-chip (SoC) development. Our IP offerings target SoCs that address a wide range of application areas including IoT, test and measurement, high speed interfaces, communications, medical imaging, and sensor hubs. Omni Design Technologies, Inc. is a privately held company with offices in Milpitas, CA and Boston, MA. Omni Design was founded in 2015 by a team of semiconductor industry veterans, technologists, and experienced entrepreneurs with a successful track record of delivering high performance analog solutions that advance the state of the art.
Learn more about Amplifier IP core
Powering the Future of RF: Falcomm and GlobalFoundries at IMS 2025
GF’s comprehensive RF portfolio, including our industry-leading RFSOI, SiGe, 22FDX+ and RF GaN platforms, is purpose-built to push the boundaries of what’s possible in connectivity, but we’re not doing it alone. Together with innovative partners like Falcomm, we’re moving the industry forward, providing our customers with cutting-edge solutions to enhance performance, power and integration and create connected technologies with higher signal quality, better efficiency and longer battery life.
Real-Time ESD Monitoring and Control in Semiconductor Manufacturing Environments With Silicon Chip of ESD Event Detection
Integrated circuits are susceptible to electrostatic discharge (ESD) events. Real-time detection and alerting of ESD events in semiconductor manufacturing environments is the key to achieving well ESD control. Additionally, the magnitude and duration of an ESD event are strongly correlated with the specific type of ESD events.
Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures
Linearity Analysis of Source-Degenerated Differential Pairs for Wireline Applications
This paper presents a comprehensive analysis of nonlinearities in differential pairs with source degeneration and their impact on wireline communication applications.
How to Elevate RRAM and MRAM Design Experience to the Next Level
This article will explore the potential advantages of RRAM and MRAM in various applications and elucidate why such new technologies are imperative to address future memory demands, as well as some challenges designers may encounter in the implementation.
Frequently asked questions about Amplifier IP cores
What is High Drive Strength Voltage Buffer on TSMC 16 FFC?
High Drive Strength Voltage Buffer on TSMC 16 FFC is a Amplifier IP core from Omni Design Technologies, Inc. listed on Semi IP Hub. It is listed with support for tsmc.
How should engineers evaluate this Amplifier?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Amplifier IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.