Audio and control DSP
The Ceva-BX1 audio digital signal controller IP handles both modest signal-processing and control workloads with up to 8 GMACs pe…
Overview
The Ceva-BX1 audio digital signal controller IP handles both modest signal-processing and control workloads with up to 8 GMACs per second performance and high-level-language programming. Yet it is power-efficient enough for always-on applications and use in wearables and TWS earbuds. The Ceva-BX1 supports a range of integer and floating-point data types for a wide range of applications, from audio signal processing to light AI workloads, with remarkably compact code size. Optimized high-speed interfaces expedite Ceva-BX1 connection to coprocessors or accelerators, and a rich software partners ecosystem provide ready-to-use application-level solutions.
The Solution
The Ceva-BX1 combines the capabilities of signal processing and control-code execution into a single compact, low-power DSP core. Computational speed comes from dual-32×32 and quad-16×16 MACs with added support for 16×8 and 8×8 MAC operations, implemented in an 11-stage pipeline. A floating-point unit supporting half, single, and double-precision IEEE floating-point is optional. These resources are directed by a four-way VLIW instruction set architecture with optimizations for single-instruction-multiple-data (SIMD) operation. A hardware loop buffer speeds kernel code execution, while efficient execution of control code is aided by dynamic branch prediction and a branch target buffer. Trusted execution modes enable secure operation. On signal-processing tasks the Ceva-BX1 can reach up to 8 GMACs per second, and on control workloads it can achieve up to 4.41 CoreMark/MHz. The hardware design is optimized for speed, achieving 2 GHz operation when implemented in a TSMC 7nm process node using only common standard cells and memory compilers.
Key features
- 4-way VLIW architecture with dual 32×32 or quad 16×16 MACs and optional half/single/double-precision IEEE floating-point unit
- Support for 8, 16, 32, and 64-bit integer operations, including 16×8 and 8×8 MAC operations for neural-network computations
- Sophisticated optimizations for control flow, including hardware loop buffer, branch target buffer, and dynamic branch prediction
- Trusted execution modes for secure operation
- Performance up to 8 GMACs per second and 4.41 CoreMark/MHz
- Hardware provisions for attaching coprocessors and accelerators
- Supported by LLVM compiler, Eclipse debug environment, and extensive libraries
Block Diagram
Benefits
- The Ceva-BX1 delivers the capabilities of both a compact audio DSP core and a capable MCU to power-constrained environments, handling both signal-processing and control workloads in a single core. DSP performance is sufficient for multi-microphone environmental noise cancellation, light AI processing, and high-accuracy sensor fusion, for examples.
- High-speed ports with automatic queuing and buffer controls make it easy to attach coprocessors and accelerators with the DSP.
- With a hardware design optimized for very low power and high speed, the performance of the Ceva-BX1 can be achieved without assembly-coding, using only C/C++ code generated by an LLVM compiler. The compiler, an RTOS, an Eclipse-based tool chain, extensive libraries for DSP and neural-network operations, and support for neural-network frameworks are all provided.
Applications
- Consumer IoT
- Automotive
Files
Note: some files may require an NDA depending on provider policy.
Specifications
Identity
Provider
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Frequently asked questions about DSP Core IP cores
What is Audio and control DSP?
Audio and control DSP is a DSP Core IP core from Ceva, Inc. listed on Semi IP Hub.
How should engineers evaluate this DSP Core?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DSP Core IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.