2.4 Gbps LVDS transmitter
065TSMC_LVDS_07 is LVDS transmitter.
Overview
065TSMC_LVDS_07 is LVDS transmitter. The interface to the core logic includes differential signal pins (INP and INN) to transmit data, and control pin EN to configure the state of the transmitter. EN pin enables of the TX LVDS, OEN pin selects Hi-Z state mode in which the output is disconnected. There are other two internal pins (VREF and IREF) to get voltage reference and current reference. OUTP and OUTN are complementary outputs to connect to the bonding pads.
Key features
- TSMC CMOS 0.065 um
- 2.5 V analog power supply
- 2.5 V CMOS input logic signals
- 2.4 Gbps (DDR MODE) switching rates
- Conforms to TIA/EIA-644 LVDS standards
- Temperature range: -40 °C to + 85 °C
- Optimized for pad-limited layout design
- Portable to other technologies (upon request)
Block Diagram
Applications
- Point-to-point data transmission
- Multidrop buses
- Clock distribution
- Backplane data transmission
- Cable data transmission
- Half-duplex or duplex data transmission
What’s Included?
- Schematic or NetList
- Abstract model (.lef and .lib files)
- Layout view (optional)
- Behavioral model (Verilog)
- Extracted view (optional)
- GDSII
- DRC, LVS, antenna report
- Test bench with saved configurations (optional)
- Documentation
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 65nm | GP | Pre-Silicon |
Specifications
Identity
Files
Note: some files may require an NDA depending on provider policy.
Provider
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Frequently asked questions about Single-Protocol PHY IP
What is 2.4 Gbps LVDS transmitter?
2.4 Gbps LVDS transmitter is a Single-Protocol PHY IP core from NTLab listed on Semi IP Hub. It is listed with support for tsmc Pre-Silicon.
How should engineers evaluate this Single-Protocol PHY?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Single-Protocol PHY IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.