TSMC CLN5FF GLink 2.0 Die-to-Die PHY
Global UniChip Corp. (GUC)
•
HQ:
Taiwan
IGPD2DY01A is a high-speed Die-to-Die interface PHY that transmits data through TSMC packaging solutions: Integrated Fan-Out (InF…
- TSMC
- 5nm
- N5FF
- Available on request