Vendor: T2M GmbH Category: Bluetooth

ultra Low power Bluetooth v5.3 Dual-Mode RF IP in TSMC40nm

Ultra-Low-Power Bluetooth Dual-Mode RF Transceiver IP in TSMC 40nm Logic LP processes node, The Radio Support standards like Blue…

Contact Provider Request Datasheet
TSMC 40nm G In Production View all specifications

Overview

Ultra-Low-Power Bluetooth Dual-Mode RF Transceiver IP in TSMC 40nm Logic LP processes node, The Radio Support standards like Bluetooth Classic (BR/EDR), Bluetooth Low Energy, 802.15.4 PHY Layer (e.g. ZigBee), and is compliant with Bluetooth ® Core Spec. Version 5.2.

The IP integrates all the calibrations required for the radio operation in an SoC, and an optional modem and is divided into an analog/RF Hard IP consisting of the RX chain from LNA to ADC, the TX chain from DAC to TX PA, and the synthesizer, The digital soft IP consisting of an RF controller, and an optional BT modulator/demodulator.

This Dual-Mode RF IP delivers the lowest power consumption together with state-of-the-art performances (sensitivity, interference rejection) at a minimal cost. The IPs-integrated LDOs, fully programmable modem, and interfaces are optimized for easy integration into SoCs and compatible with leading BT Controllers.

Key features

  • Compliant with Bluetooth 5.2 dual mode
  • Single-ended antenna with internal matching network
  • Minimum mask layers
  • Minimum IO pins
  • Radio analog hard IP area < 0.7mm2. Digital soft IP is less than 200K gates.
  • Excellent RX Noise Figure <6dB, up to 10dBm TX output power
  • Ultra-Low Power Operation, RX mode power consumption (@ sensitivity, 1Mbps) <8.8mW @1.1V(core voltage), TX mode power consumption (@ 0dBm) <15mW @1.1V
  • Integrated with ESD protected I/O pads
  • Technology Node: TSMC 40nm Logic LP/ULP
  • Junction Temperature Range of -400C to 1250C

Applications

  • Mono/Stereo Headset
  • Mono/Stereo Speaker
  • mPOS
  • Printers

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 40nm G In Production

Specifications

Identity

Part Number
Bluetooth v5.3 Dual-Mode RF IP in TSMC40nm ULP
Vendor
T2M GmbH

Provider

T2M GmbH
T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets. T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules. With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.
Contact T2M GmbH

Learn more about Bluetooth IP core

HDT Bluetooth: the Next Step in High Quality Audio Streaming

Wireless audio (wireless earbuds, headphones and speakers) introduced us to a completely new level of listening convenience and freedom, prompting the rapid growth we are already seeing in this consumer segment (30% CAGR for wireless earbuds and 14% for wireless headphones). Now the race is on to further improve audio quality and capability in these devices.

Three Major Inflection Points for Sourcing Bluetooth Intellectual Property

Synopsys is now shipping support for Bluetooth® 5.4, the latest specification from the Bluetooth SIG (Special Interest Group). The enhancements in Bluetooth 5.4 will open additional markets and use cases. This is one of the many inflection points in the Bluetooth Low Energy market that will be discussed in this paper.

Frequently asked questions about Bluetooth IP cores

What is ultra Low power Bluetooth v5.3 Dual-Mode RF IP in TSMC40nm?

ultra Low power Bluetooth v5.3 Dual-Mode RF IP in TSMC40nm is a Bluetooth IP core from T2M GmbH listed on Semi IP Hub. It is listed with support for tsmc In Production.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

×
Semiconductor IP