Vendor: Arasan Chip Systems Inc. Category: MIPI RFFE

RFFE Master IP Core

Mobile radio communication systems are complex multi-radio systems comprising several transceivers.

Overview

Mobile radio communication systems are complex multi-radio systems comprising several transceivers. Arasan supports the latest MIPI RFFE standard v3.0. The RFFE bus is a 2-wire serial interface that utilizes a bus frequency of up to 52 MHz and timing accurate trigger mechanisms to allow control of timing-critical functions. It is used to connect a digital RFIC to RF front end components, like Power Amplifiers, Low-Noise Amplifiers, and Antenna Sensors, which are considered RFFE Slaves.

The RFFE Master v3.0 IP core typically resides in the RFIC in a mobile platform, and utilizes the RFFE bus to identify, program, and monitor the registers in RF front end Slave devices through programmed IO. It is designed to support existing standards such as LTE, UMTS, HSPA and EGPRS, and is usable in configurations ranging from single Master/single Slave to multi-Master/multi-Slave.

At a minimum, Arasan delivers RFFE Master in RTL form. Physical designs of the complete RFFE Master, including the Pad Logic block for CLK and DATA as shown below, can be provided upon request.

 

Key features

  • Compliant with MIPI RFFE Specification 3.0
  • Delivered in Reuse Methodology Manual (RMM) compliant Verilog RTL format
  • Optionally delivered as a physical design
  • Small footprint
  • Up to 15 Devices can be connected per RFFE bus
  • Low pin count on RFFE interface (SCLK and SDATA)
  • Low EMI 
  • Low power consumption
  • RFFE clock speed of 52 MHz
  • Supports all Mandatory features required for RFFE Master as specified in the MIPI RFFE Specification.
  • Can be easily customized to add additional optional features.
  • Backward compatible with RFFE v2.0 master core IP and v1.0 master core IP

Block Diagram

Benefits

  • Silicon proven
  • Fully compliant to MIPI RFFE standard
  • Small footprint
  • Code validated with Spyglass
  • Functionality ensured with comprehensive verification
  • Premier direct support from Arasan IP core designers

What’s Included?

IP Deliverables for Digital Core

  • Verilog HDL of the IP Core
  • User guide
  • Gate count estimates available upon request
  • Synthesis scripts
  • Simulation environment including test bench, BFM’s, and exhaustive test suite

Additional Deliverables, for Physical Design (optional)

  • GDS-II Database
  • LVS Netlist
  • Physical Abstract Models (LEF)
  • Timing Models (LIB)

Files

Note: some files may require an NDA depending on provider policy.

Specifications

Identity

Part Number
RFFE Master IP Core
Vendor
Arasan Chip Systems Inc.
Type
Silicon IP

Provider

Arasan Chip Systems Inc.
HQ: USA
Arasan Chip Systems, is a leading provider of IP for mobile storage and mobile connectivity interfaces with over a billion chips shipped with our IP. Arasan’s high-quality, silicon-proven, Total IP Solutions include digital IP, Analog Mixed Signal PHY IP, Verification IP, HDK, and Software. Arasan has a focused product portfolio targeting mobile SoCs. The term Mobile has evolved over our two-decade history to include all things mobile – starting with PDA’s in the mid 90’s to smartphones to today’s Automobiles, Drones, and IoT. Arasan is at the forefront of this evolution of “Mobile” with its standards-based IP at the heart of Mobile SoCs.

Learn more about MIPI RFFE IP core

Frequently asked questions about MIPI RFFE IP cores

What is RFFE Master IP Core?

RFFE Master IP Core is a MIPI RFFE IP core from Arasan Chip Systems Inc. listed on Semi IP Hub.

How should engineers evaluate this MIPI RFFE?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this MIPI RFFE IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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