Vendor: T2M GmbH Category: Bluetooth

BLE v5.4 RF IP in TSMC22 ULP

Ultra-Low-Power BLE RF IP is designed to support 2.4 GHz standards like Bluetooth Classic (BR/EDR), 802.15.4 PHY Layer (e.g., Zig…

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TSMC 22nm ULP In Production View all specifications

Overview

Ultra-Low-Power BLE RF IP is designed to support 2.4 GHz standards like Bluetooth Classic (BR/EDR), 802.15.4 PHY Layer (e.g., ZigBee), ANT, and proprietary standards. This BLE RF IP in TSMC 22nm delivers the lowest power consumption together with state-of-the-art performances (sensitivity, interference rejection) at a minimal cost. The IPs integrated LDOs, fully programmable modem and interfaces are optimized for easy integration into SoCs and compatible with leading BT Controllers.
Our IP is targeted for AIoT /Bluetooth Audio (TWS Earbuds, headsets, etc.) /Hearables /Smart Watches/ Hearing Aids, etc.

Key features

  • Smallest Analog die area.
  • Tx Output power +12dBm, Rx Sensitivity -98dBm.
  • Compatible with leading Link Layer and Stack IP Cores.
  • Universal BLE Audio Streaming
  • Flexible integrated modem compatible with Bluetooth, 802.15.4, and other modulations
  • Average Power Consumption - stereo streaming:
    • 0.6mW - BLE Only
  • Rx Sensitivity - Best-in-class:
    • -98 dBm – BLE @2Mbps
  • Long Range and Direction Finding (DF) options.
  • Industrial temperature range: -40°C to +125°

Applications

  • TWS earbuds, Headsets
  • Smart Speakers, Wearables

What’s Included?

  • GDSII or Source Code
  • TurnKey ASIC developed on core IP

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 22nm ULP In Production

Specifications

Identity

Part Number
BLE v5.4 RF IP in TSMC 22nm ULP
Vendor
T2M GmbH

Provider

T2M GmbH
T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets. T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules. With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.
Contact T2M GmbH

Learn more about Bluetooth IP core

HDT Bluetooth: the Next Step in High Quality Audio Streaming

Wireless audio (wireless earbuds, headphones and speakers) introduced us to a completely new level of listening convenience and freedom, prompting the rapid growth we are already seeing in this consumer segment (30% CAGR for wireless earbuds and 14% for wireless headphones). Now the race is on to further improve audio quality and capability in these devices.

Three Major Inflection Points for Sourcing Bluetooth Intellectual Property

Synopsys is now shipping support for Bluetooth® 5.4, the latest specification from the Bluetooth SIG (Special Interest Group). The enhancements in Bluetooth 5.4 will open additional markets and use cases. This is one of the many inflection points in the Bluetooth Low Energy market that will be discussed in this paper.

Frequently asked questions about Bluetooth IP cores

What is BLE v5.4 RF IP in TSMC22 ULP?

BLE v5.4 RF IP in TSMC22 ULP is a Bluetooth IP core from T2M GmbH listed on Semi IP Hub. It is listed with support for tsmc In Production.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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