Vendor: T2M GmbH Category: Bluetooth

BLE v5.0 RF PHY KGD & IP

A RF Transceiver (IP/die) for adding Bluetooth Low Energy v5.2 (2.4GHz) capability to any SoC with embedded MCU via a standard SP…

TSMC 40nm G In Production View all specifications

Overview

A complete RF Transceiver (IP/die) for adding Bluetooth Low Energy v5.2 (2.4GHz) capability to any SoC with embedded MCU via a standard SPI interface.

Integrated BLE Link Layer enables data rates of 2Mbps for High Speed Bluetooth connectivity & Long Range for connection range of ~100 meters.

Standard SPI interface plus chip select & packet sync pins for interfacing to an MCU or SOC and accessing an integrated AES engine for data encryption/decryption. No external RAM, ROM or Flash is not required.

Low cost & simple upgrade to any embedded MCU system.

Key features

  • 2.4GHz RF Bluetooth Low Energy v5.2 Phy
  • BQB Bluetooth® 5 Low Energy Certified: RF PHY Component, Link Layer, Protocol Stack SW, MESH SW
  • Data Rate Supported: 2Mbps & 1Mbps
  • Integrated functionality: RF Transceiver + Modem Phy, CRC & AES-CCM HW security engine, Integrated DC-DC and LDO regulator, 16MHz / 32MHz XTAL, 32KHz XTAL
  • High TX Power: +10dBm
  • High RX sensitivity: -97dBm (1Mb/s PHY BER=0.1%)
  • Very Low Power Consumption: Standby & Deep Sleep functions
  • TSMC55 ULP

Block Diagram

Files

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 40nm G In Production

Specifications

Identity

Part Number
BLE v5.0 RF KGD & IP
Vendor
T2M GmbH

Provider

T2M GmbH
T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets. T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules. With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.

Learn more about Bluetooth IP core

HDT Bluetooth: the Next Step in High Quality Audio Streaming

Wireless audio (wireless earbuds, headphones and speakers) introduced us to a completely new level of listening convenience and freedom, prompting the rapid growth we are already seeing in this consumer segment (30% CAGR for wireless earbuds and 14% for wireless headphones). Now the race is on to further improve audio quality and capability in these devices.

Three Major Inflection Points for Sourcing Bluetooth Intellectual Property

Synopsys is now shipping support for Bluetooth® 5.4, the latest specification from the Bluetooth SIG (Special Interest Group). The enhancements in Bluetooth 5.4 will open additional markets and use cases. This is one of the many inflection points in the Bluetooth Low Energy market that will be discussed in this paper.

Frequently asked questions about Bluetooth IP cores

What is BLE v5.0 RF PHY KGD & IP?

BLE v5.0 RF PHY KGD & IP is a Bluetooth IP core from T2M GmbH listed on Semi IP Hub. It is listed with support for tsmc In Production.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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