Vendor: Crossbar Category: MRAM / RRAM

3D Resistive RAM - High-Density Memory

CrossBar Resistive RAM (ReRAM) High-Density Memory IP cores are an ideal choice for high-density, low-latency memory applications…

Overview

CrossBar Resistive RAM (ReRAM) High-Density Memory IP cores are an ideal choice for high-density, low-latency memory applications such as data center storage, mobile computing, consumer electronics and artificial intelligence. They offer high density, low latency, high performance and low power in a non-volatile memory solution.

CrossBar is enabling a new class of persistent memory solutions for read-intensive applications that benefit from the superior characteristics of CrossBar’s 3D ReRAM technologies.

Supported densities are from 64Gbits (8GBytes) or custom sizes, enabling 128GB NVDIMM to 1TB NV-DIMM with 8 chips per package. At system level, NV-DIMM read performance achieves 25.6 GB/s – 64 IOs – 250ns random read latency while consuming less than 1W active reads.

In addition to high-density non-volatile memory applications, CrossBar is also offering its high-density ReRAM technology for use in security applications, where the ReRAM cell is utilized for secure physical unclonable function (PUF) keys embedded in semiconductors.

Files

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Specifications

Identity

Part Number
3D Resistive RAM - High-Density Memory
Vendor
Crossbar

Provider

Crossbar
HQ: USA
Crossbar is the leader in ReRAM technology, enabling kilobytes to terabytes of always-on data storage to be embedded into any processor, microcontroller, FPGA or as a standalone memory chip. Crossbar ReRAM lets designers rethink the compute/storage paradigm, free from the constraints of traditional flash and DRAM memories. From “persistent memory” that brings data closer to CPU to “cognitive memory” that enables in-memory computing without a host CPU, ReRAM is ushering in a new era of data storage and processing for both edge and cloud computing.

Learn more about MRAM / RRAM IP core

How to Elevate RRAM and MRAM Design Experience to the Next Level

This article will explore the potential advantages of RRAM and MRAM in various applications and elucidate why such new technologies are imperative to address future memory demands, as well as some challenges designers may encounter in the implementation.

NVMe IP for Enterprise SSD

Most of SSD manufacturers jumped into this new storage market with flash-based technology. A second wave of products will come in the near future, using a new generation of non-volatile memories, delivering impressive speed performances compared to NandFlash memories. The SSD manufacturers will have to deal with low latency SSD controller design in order to benefit from the new NVM features, while keeping high reliability and low power consumption. This white paper proposes a solution based on a full hardware NVMe implementation, describing its architecture, implementation and characterization.

Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators

Unprecedented penetration of artificial intelligence (AI) algorithms has brought about rapid innovations in electronic hardware, including new memory devices. Nonvolatile memory (NVM) devices offer one such attractive alternative with ∼2× density and data retention after powering off. Compute-in-memory (CIM) architectures further improve energy efficiency by fusing the computation operations with AI model storage. Electronic characteristics of NVM devices, like resistance in the two resistance states, directly affect the circuit designers’ decisions and result in the varying performance of NVM-CIM chips.

Frequently asked questions about MRAM / RRAM IP cores

What is 3D Resistive RAM - High-Density Memory?

3D Resistive RAM - High-Density Memory is a MRAM / RRAM IP core from Crossbar listed on Semi IP Hub.

How should engineers evaluate this MRAM / RRAM?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this MRAM / RRAM IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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