Vendor: Gear Radio Electronics Corp. Category: Bluetooth

2.4GHz transceiver for Bluetooth application

The GR1000 RF IPs are a 2.4GHz transcevier for Bluetooth application which have TX, RX, SX, and AFE blocks.

Overview

The GR1000 RF IPs are a 2.4GHz transcevier for Bluetooth application which have TX, RX, SX, and AFE blocks. T/R switch is integrated in our design. The IPs are fully compliant with the Bluetooth 5 standard. The transmitter output power can exceed 10dBm. The receiver current consumption is 12.6mA at maximum gain setting.

Key features

Main Features

  • UMC55nm uLP process
  • RF front end area < 0.85mm2
  • Temperature: -20 to 85°C
  • On-chip matching network

Bluetooth Core Specification 5

  • 2400-2484MHz
  • Master and slave mode support

Bluetooth Core Specification 5

  • Reference input Clock: 16/24/32/40MHz

RF Performance

  • Class 1 TX power up to +10dBm
  • RX sensitivity < -95dBm

Block Diagram

Applications

  • Human Interface Device (HID)
  • Remote keyless entry
  • Audio
  • VoIP Headsets
  • Wearable

What’s Included?

  • GDSII files for the RF front end.
  • RF transceiver integrated with pad ring for ease of integration and floor planning.
  • Netlist for modem, link layer.
  • Test vectors, timing and physical abstraction models.
  • Integration manual and release notes.

Support Deliverables

  • A RF EVB with a demonstration chip containing the Bluetooth-Gear series radio IP.
  • Reference design, PCB layout.
  • Radio control tool, RF test guidance.
  • Production test & radio calibration algorithm.

Files

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
UMC 55nm ULP

Specifications

Identity

Part Number
GR1000 - RF TRX
Vendor
Gear Radio Electronics Corp.
Type
Silicon IP

Provider

Gear Radio Electronics Corp.
HQ: Taiwan
Gear Radio Electronics Corp. is a research and development high-tech company dedicated to IoT communication design service solutions. The company brings together top talent from industry-leading heavy-duty chip design companies, covering RF analogy, systems, algorithms, software and digital circuit design and development expertise. Focusing on the IoT communication field, the core is the hardware circuit design. The goal is to create an optimized solution that will provide customers with a better user experience. Gear Radio Electronics Corp. was established in June 2016 with a registered capital of US$4 million, and is located at the Innovation and Development Building of Tsinghua University in Hsinchu, Taiwan. The company's first RF IP chip was launched in the first quarter of 2017 and successfully passed verification. Gear Radio Electronics Corp. is a wireless RF IC design and service company. It has integrated circuit design experience and a passionate RF technology development partner team that can design a complete RF solution. The entire team has extensive design experience and has design capabilities for all frequency bands in RF applications. We can provide design services for any RF application from 1GHz to commercial 2.4GH to UHF. In addition, we have extensive production experience from 110nm to 28nm process nodes. We have been studying technology in depth and have issued a number of patents. While meeting customer needs, we are constantly pursuing excellence in technology and breakthroughs. The main product line is Bluetooth IP, including dual-mode and single-mode low-power solutions. Bluetooth dual-mode IP includes wireless RF transceivers and wireless RF demodulators. Single-mode low-power IP includes the physical layer, link layer and protocol layer, providing customers with a complete solution for rapid product introduction. In addition to the standard communication IP, there is a custom IP design service that can provide customers with a dedicated IP. Professional IC design technology and comprehensive services are our mission. We believe this is the only service that can attract people. Insist on design innovations that apply to each project implementation; Gear Radio Electronics Corp. also expressed this insistence to each guest. We listen carefully to the needs of our customers, develop our products with unique innovation, and adopt the highest technical specifications to enable our customers to create a new vision. Our goal is to become an industry-leading indicator and to meet the diverse needs of our customers through continuous breakthrough technologies. Our mission is to continuously innovate and provide our customers with superior products and services. Our philosophy is "Integrity," "Innovation," and "Proactive". We continue to make breakthroughs and become a world-class wireless chip design company.

Learn more about Bluetooth IP core

HDT Bluetooth: the Next Step in High Quality Audio Streaming

Wireless audio (wireless earbuds, headphones and speakers) introduced us to a completely new level of listening convenience and freedom, prompting the rapid growth we are already seeing in this consumer segment (30% CAGR for wireless earbuds and 14% for wireless headphones). Now the race is on to further improve audio quality and capability in these devices.

Three Major Inflection Points for Sourcing Bluetooth Intellectual Property

Synopsys is now shipping support for Bluetooth® 5.4, the latest specification from the Bluetooth SIG (Special Interest Group). The enhancements in Bluetooth 5.4 will open additional markets and use cases. This is one of the many inflection points in the Bluetooth Low Energy market that will be discussed in this paper.

Frequently asked questions about Bluetooth IP cores

What is 2.4GHz transceiver for Bluetooth application?

2.4GHz transceiver for Bluetooth application is a Bluetooth IP core from Gear Radio Electronics Corp. listed on Semi IP Hub. It is listed with support for umc.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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